H5AN4G8NBJR-PBC vs H5AN4G8NBJR-UHI Comparison

Detailed side-by-side comparison of H5AN4G8NBJR-PBC by SK hynix and H5AN4G8NBJR-UHI by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5AN4G8NBJR-UHI H5AN4G8NBJR-UHI - 4Gb DDR4-2400 SDRAM | SK hynix

H5AN4G8NBJR-UHI - 4Gb DDR4-2400 SDRAM | SK hynix

H5AN4G8NBJR-UHI ✓ Active

Specification Comparison

Parameter H5AN4G8NBJR-PBC H5AN4G8NBJR-UHI
Brand SK hynix SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $2.20 $2.25
Memory Density 4 Gbit —
Organization 512M x 8 512M x 8
Memory Type DDR4 SDRAM DDR4 SDRAM
Interface Type Parallel, JEDEC DDR4 —
Supply Voltage VDD 1.2 V —
Supply Voltage VDDQ 1.2 V —
Speed Grade PBC DDR4-2400 (PC4-19200)
Clock Frequency [DATA_NEEDED: Clock Frequency] —
CAS Latency (CL) [DATA_NEEDED: CAS Latency] —
Package 78-ball FBGA FBGA-78 (78-ball fine-pitch BGA)
Mounting Type Surface Mount Surface Mount
Normal Operating Case Temperature 0C to 85C —
Extended Temperature Range up to 95C case (with increased refresh) —
Lead Free Yes —
Halogen Free Yes —
Refresh 8n prefetch, standard/auto refresh per DDR4 JEDEC Self-refresh and auto-refresh support
Density — 4 Gbit
Supply Voltage (VDD) — 1.2 V
Grade — Industrial (-UHI suffix)
Data Rate — 2400 MT/s
Interface — JEDEC DDR4 SDRAM
Bank Architecture — DDR4 bank group architecture
Termination — On-die termination (ODT)
Operating Temperature — [DATA_NEEDED: operating temperature range]
CAS Latency — [DATA_NEEDED: CAS latency at DDR4-2400]
RoHS Status — [DATA_NEEDED: RoHS status]
MSL Level — [DATA_NEEDED: moisture sensitivity level]

Datasheets & Resources

Browse All Products Create BOM Request Quote