H5AN4G8NBJR-UHI vs H5AN4G8NBJR-VKC Comparison
Detailed side-by-side comparison of H5AN4G8NBJR-UHI by SK hynix and H5AN4G8NBJR-VKC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | H5AN4G8NBJR-UHI | H5AN4G8NBJR-VKC |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2.25 | $2.40 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gbit | — |
| Organization | 512M x 8 | — |
| Speed Grade | DDR4-2400 (PC4-19200) | — |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| Package | FBGA-78 (78-ball fine-pitch BGA) | FBGA-78 (7.5 x 11 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Grade | Industrial (-UHI suffix) | — |
| Data Rate | 2400 MT/s | 2666 Mbps (DDR4-2666) |
| Interface | JEDEC DDR4 SDRAM | — |
| Bank Architecture | DDR4 bank group architecture | — |
| Refresh | Self-refresh and auto-refresh support | [DATA_NEEDED: refresh rate] |
| Termination | On-die termination (ODT) | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| CAS Latency | [DATA_NEEDED: CAS latency at DDR4-2400] | [DATA_NEEDED: CAS latency for 2666 grade] |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant (Lead-Free & Halogen-Free per datasheet) |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Memory Size | — | 4 Gb |
| Memory Organization | — | 512M x8 |
| Memory Interface | — | Parallel |
| Technology | — | CMOS DRAM |
| Volatile / Non-Volatile | — | Volatile |
| Packaging | — | Tray |
| Lifecycle Status | — | Active |