SK hynix

H5AN4G8NBJR-VKC - 4Gb DDR4-2666 SDRAM x8 | SK hynix

MPN: H5AN4G8NBJR-VKC ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss FBGA-78 (7.5 x 11 mm) Package DDR4 SDRAM Memory
From $2.4 USD / Unit
MOQ: 1 |
Price updated: 2026-09-04
Volume Pricing
Qty Unit Price Extended
1 $8.69 $8.69
10 $6.2 $62.00
100 $4.5 $450.00
500 $3.1 $1,550.00
1,000 $2.6 $2,600.00
5,000 $2.4 $12,000.00
ℹ️ All prices are in USD

Drop-in alternatives for H5AN4G8NBJR-VKC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

H5AN4G8NBJR-UHI

✅ Drop-In
SK hynix
📦 FBGA-78
DDR4 SDRAM · 4 Gbit · 512M x 8 · DDR4-2400 (PC4-19200) · 1.2 V · FBGA-78 (78-ball fine-pitch BGA) · Surface Mount · Industrial (-UHI suffix)

✓ In Stock

$2.25 / Unit

View Datasheet →

H5AN4G8NBJR-UHC

✅ Drop-In
SK hynix
📦 FBGA-78
DDR4 SDRAM · 4 Gbit · 512M x 8 · 2400 Mbps (PC2400) · 1.2 V · DDR4 (JEDEC) · TFBGA-78 (11 x 7.5 mm) · Surface Mount

✓ In Stock

$3.18 / Unit

View Datasheet →

H5AN4G8NBJR-RDC

✅ Drop-In
SK hynix
📦 FBGA-78
DDR4 SDRAM · 4 Gbit · 512M x 8 · DDR4 (Double Data Rate IV) · 78-ball FBGA · Surface Mount · [DATA_NEEDED: VDD supply voltage] · [DATA_NEEDED: speed grade Mbps]

✓ In Stock

$2.95 / Unit

View Datasheet →

H5AN4G8NBJR-PBC

✅ Drop-In
SK hynix
📦 FBGA-78
4 Gbit · 512M x 8 · DDR4 SDRAM · Parallel, JEDEC DDR4 · 1.2 V · 1.2 V · PBC · [DATA_NEEDED: Clock Frequency]

✓ In Stock

$2.2 / Unit

View Datasheet →

H5AN4G8NAFR-TFC

✅ Drop-In
📦 FBGA-78
earlier A-die revision of same 4Gb x8 DDR4-2666 family, same FBGA-78 footprint per Lisleapex comparison

📋 Reference alternative (not in catalog)

H5AN4G8NBJR-VKC Maximum Ratings & Electrical Characteristics

Memory Type DDR4 SDRAM
Memory Size 4 Gb
Memory Organization 512M x8
Data Rate 2666 Mbps (DDR4-2666)
Memory Interface Parallel
Supply Voltage (VDD) 1.2 V
Package FBGA-78 (7.5 x 11 mm)
Mounting Type Surface Mount
Technology CMOS DRAM
Volatile / Non-Volatile Volatile
RoHS Status Compliant (Lead-Free & Halogen-Free per datasheet)
Packaging Tray
Lifecycle Status Active

H5AN4G8NBJR-VKC fbga-78 (7.5 x 11 mm) Pin Configuration Guide

Complete pinout information for H5AN4G8NBJR-VKC (fbga-78 (7.5 x 11 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

fbga-78 (7.5 x 11 mm) package pinout diagram for H5AN4G8NBJR-VKC

No detailed pinout data available for H5AN4G8NBJR-VKC.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for H5AN4G8NBJR-VKC Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

H5AN4G8NBJR-VKC is suitable for 6 applications: PC Main Memory Modules (UDIMM/SODIMM), Embedded x86/ARM Computing Platforms, Networking and Communication Equipment, Smart TV and Set-Top Box Systems, Industrial Computers and Human-Machine Interfaces, Gaming Consoles and Graphics-Adjacent Buffers.

🖥️

PC Main Memory Modules (UDIMM/SODIMM)

The H5AN4G8NBJR-VKC is a mainstream choice for desktop and notebook memory modules. With 4Gb density in a x8 organization, eight chips populate a 4GB non-ECC UDIMM, while sixteen chips build ECC server-class configurations. Its 2666 Mbps data rate and 1.2 V operation align with Intel and AMD DDR4 platforms of the corresponding generation, providing roughly 21 GB/s theoretical peak bandwidth per 64-bit channel. On module designs, the fly-by command/address topology and on-die termination supported by this DDR4 generation simplify routing compared with DDR3 T-topologies. Designers should match speed grade (CL and tRCD/tRP timings from the SK hynix series datasheet) with the SPD programming so host BIOS memory training runs correctly.

🏭

Embedded x86/ARM Computing Platforms

Industrial PCs, gateways, and edge-compute boards based on Intel Atom, AMD Embedded, or high-end ARM SoCs frequently specify 4Gb DDR4 x8 DRAM. The H5AN4G8NBJR-VKC's 2666 Mbps grade supports the memory clock options these SoCs expose, and its 1.2 V rail integrates cleanly with common PMIC DDR4 rails including the 2.5 V VPP wordline supply. In soldered-down embedded designs, the 78-ball FBGA (7.5 x 11 mm) footprint supports down-to-2.4 mm module-height constraints common in fanless enclosures. Memory controller training must program CAS latency and ODT settings to the VKC grade's datasheet timing table, and layout should follow byte-lane length matching within the SoC vendor's skew budget for stable operation at speed.

🌐

Networking and Communication Equipment

Enterprise switches, routers, and line cards use DDR4 SDRAM for packet buffers, route tables, and control-plane memory. The H5AN4G8NBJR-VKC provides 4Gb per chip with 2666 Mbps bandwidth, letting designers scale buffering with a modest chip count while keeping power low at 1.2 V - important in airflow-constrained switch chassis. The x8 organization balances data-bus width against chip count for 64-bit or 72-bit ECC-wide interfaces. Network processors and merchant silicon commonly include validated DDR4 support lists; confirm the SK hynix BJR family appears there. Thermal design should account for continuous full-bandwidth traffic, keeping junction temperature within the -C commercial grade rating via board-level airflow over the FBGA-78 package.

📺

Smart TV and Set-Top Box Systems

4K smart TVs and IPTV set-top boxes require 2-4 GB of DDR4 for video frame buffers, graphics surfaces, and the Linux application stack. The H5AN4G8NBJR-VKC's 4Gb x8 configuration lets two to eight chips cover these densities, and its 2666 Mbps grade matches the memory interfaces of mainstream TV SoCs from MediaTek, Amlogic, and Novatek. The 1.2 V operation reduces standby power, supporting ENERGY STAR-class idle targets, while the compact FBGA-78 package fits the thin PCB stacks used in panel-integrated boards. Designers must ensure the SoC's DDR4 support list includes the SK hynix BJR die revision and program boot-time training parameters per the series datasheet timing tables for reliable cold-boot at 2666 Mbps.

🔧

Industrial Computers and Human-Machine Interfaces

Panel PCs, CNC controllers, and vision-system HMI hardware use DDR4 for Windows- and Linux-class operating systems. The H5AN4G8NBJR-VKC's 4Gb density supports 4-8 GB soldered configurations typical of these platforms, and its 2666 Mbps rate satisfies the memory bandwidth needs of multi-display graphics stacks. In factory environments, board-level reliability comes from solid VTT termination design and conformal-coating-compatible layout rather than component grading - so verify the -C commercial temperature suffix against your cabinet ambient profile, or select the -I industrial grade variants in the same H5AN4G8NBJR family when -40 C to +85 C operation is required. Lead-free, halogen-free construction aids industrial RoHS compliance programs.

🎮

Gaming Consoles and Graphics-Adjacent Buffers

Cost-sensitive game consoles, arcade boards, and GPU frame-buffer subsystems often pair a discrete DDR4 bank with the graphics chipset. The H5AN4G8NBJR-VKC supplies 4Gb per device at 2666 Mbps, and multiple chips can be ganged into 64-bit or wider buses for several GB/s of aggregate bandwidth. Its 1.2 V operation keeps thermal output manageable inside sealed consumer enclosures, and the standardized DDR4 interface lets firmware reuse memory-training code across SK hynix and Micron second sources. At sustained gaming loads the FBGA-78 package relies on PCB copper planes for heat spreading; designers should budget junction temperature using the series datasheet thermal data and validate under worst-case title power profiles.

What is the H5AN4G8NBJR-VKC?
The H5AN4G8NBJR-VKC is a 4 Gigabit DDR4 SDRAM from SK hynix organized as 512M x8 and rated for a 2666 Mbps data rate (DDR4-2666). It operates from a 1.2 V supply and comes in a 78-ball FBGA package measuring about 7.5 x 11 mm. According to the SK hynix H5AN4GxNBJR series datasheet, the family targets main memory applications requiring large memory density and high bandwidth.
What is the price of H5AN4G8NBJR-VKC?
Distributor pricing for the H5AN4G8NBJR-VKC ranges roughly from $2.33 to $8.69 per piece for single-unit quantities as of 2026-09-04, per Easybom's comparison of 8 distributors. Volume pricing typically falls toward the lower end: expect approximately $2.40 to $3.10 per unit at 500-1000 piece quantities. Final pricing depends on stock position, packaging (tray), and distributor, so request quotes from multiple sources for accurate procurement.
Where to buy H5AN4G8NBJR-VKC online?
The H5AN4G8NBJR-VKC is available through multiple online distributors including LCSC, Ampheo, Win Source, Wolfchip, Avaq, and AIChipLink, and is listed on Octopart for price comparison across 9 distributors. XAIPART also offers this part with quote support. Stock levels reported as of 2026 include approximately 39,200 pieces at Wolfchip (updated April 2026) and 10,000+ pieces at LimChip. Verify stock freshness before ordering, as DRAM inventory moves quickly.
Is H5AN4G8NBJR-VKC in stock?
Availability varies by distributor as of 2026-09-04: Wolfchip reported 39,200 pieces in stock updated April 08, 2026, LimChip listed 10,000+ pieces, and icDirectory indicated 30,000 pieces. However, LCSC listed the part as Out of Stock. Because DDR4 demand fluctuates, confirm real-time stock and lead time with your chosen distributor before committing to a production schedule.
What is the best drop-in replacement for H5AN4G8NBJR-VKC?
The best drop-in replacements are same-family SK hynix parts in the identical 78-ball FBGA package: H5AN4G8NBJR-UHI, H5AN4G8NBJR-UHC, H5AN4G8NBJR-RDC, and H5AN4G8NBJR-PBC, which differ mainly in speed grade and temperature suffix. H5AN4G8NAFR-TFC (earlier die revision) is also footprint-compatible. Always verify the speed grade supported by your memory controller before substituting a slower or faster grade.
What is the difference between H5AN4G8NBJR-VKC and H5AN4G8NBJR-UHC?
Both parts are 4Gb DDR4 SDRAM, 512M x8, in the same 78-ball FBGA package with the same B-die family base. The difference lies in the speed/temperature grade suffix: -VKC denotes the 2666 Mbps commercial grade, while -UHC denotes a different speed grade within the same family. Your memory controller must be programmed to match the CAS latency and timings of whichever grade you install; consult both datasheets for exact timing tables.
H5AN4G8NBJR-VKC vs H5AN8G8NCJR-VKC - which should I choose?
Choose based on density: H5AN4G8NBJR-VKC is a 4Gb (512M x8) DDR4-2666 part, while H5AN8G8NCJR-VKC is an 8Gb (1G x8) DDR4 part from the newer C-die generation - double the density per chip. Both use x8 organization and similar ball-count FBGA footprints per Octopart comparison data, but the C-die part may differ in ballout and controller support. For cost-optimized 4Gb designs choose the BJR-VKC; for higher density choose the 8Gb part.
Is H5AN4G8NBJR-VKC suitable for embedded industrial systems?
Yes, the H5AN4G8NBJR-VKC suits industrial embedded computing when operated within its commercial temperature range and paired with a DDR4-compatible SoC or memory controller. Its 4Gb density supports Linux-class operating systems comfortably, and the 1.2 V operation reduces power versus DDR3. For extended-temperature industrial applications, verify the -C commercial suffix meets your ambient requirements, or consider the -I industrial grade variants in the same H5AN4G8NBJR family.
What is the best SK hynix equivalent for other brands' DDR4 memory?
SK hynix DDR4 4Gb x8 equivalents from other manufacturers include Micron MT40A512M8 (DDR4 x8, 4Gb) and Samsung K4A4G085W series, all JEDEC-standard DDR4 SDRAMs. Note that while DDR4 is a standardized interface, ballout compatibility across vendors must be confirmed for each part because package options (FBGA-78 vs FBGA-96 for x16) and die revisions differ. Always run the cross-reference against your controller's supported memory list before qualifying a second source.
Where to download the H5AN4G8NBJR-VKC datasheet PDF?
The H5AN4G8NBJR-VKC datasheet is available from SK hynix and distributor mirrors: the H5AN4G4/8/6NBJR series datasheet PDF is hosted at DigiKey (media.digikey.com, H5AN4GxNBJR Series, 48-page document listed as 716 Kb on Alldatasheet). Alldatasheet, Ampheo, and electronicsdatasheets.com also provide free PDF downloads covering the -xxC suffix variants including the VKC grade.
What are the key specifications of H5AN4G8NBJR-VKC that engineers should know?
Key facts: 4 Gb DDR4 SDRAM, 512M x8 organization, 2666 Mbps data rate, 1.2 V core supply, 78-ball FBGA package (7.5 x 11 mm), volatile CMOS DRAM technology, lead-free and halogen-free, tray packaging, active lifecycle status. Source: SK hynix H5AN4GxNBJR series datasheet and distributor listings verified 2026-09-04. CAS latency and detailed timing parameters for the VKC speed grade should be taken from the series timing table.
What voltage does H5AN4G8NBJR-VKC use?
The H5AN4G8NBJR-VKC operates from a 1.2 V core supply (VDD), consistent with the JEDEC DDR4 SDRAM standard generation it belongs to. DDR4's reduction from DDR3's 1.5 V lowers dynamic power significantly - roughly 20% at equal data rate. Designs must also supply VPP (2.5 V wordline boost rail) per DDR4 architecture; consult the series datasheet for exact VDD, VDDQ, and VPP tolerances before finalizing the power tree.
Is H5AN4G8NBJR-VKC RoHS compliant?
Yes, the H5AN4G8NBJR-VKC is RoHS compliant, lead-free, and halogen-free. The series datasheet explicitly describes the family as Lead-Free & Halogen-Free, and the JLCPCB part listing confirms FBGA-78 DDR SDRAM with RoHS status. This makes the part suitable for EU-market and green-manufacturing programs. Always retain the manufacturer's material declaration certificate for your compliance audit records.
Hey Google, can H5AN4G8NBJR-UHI replace H5AN4G8NBJR-VKC?
In most cases yes - H5AN4G8NBJR-UHI is the same 4Gb, 512M x8 DDR4 SDRAM die family in the same 78-ball FBGA package, so it is footprint and function compatible. The suffix differences denote speed grade and temperature rating, so the memory controller must support the UHI grade's timings. If your design runs at 2666 Mbps, confirm the UHI grade meets that data rate on its datasheet speed table before the swap.
What design considerations apply to DDR4 PCB layout for the H5AN4G8NBJR-VKC?
At 2666 Mbps, DDR4 layout demands fly-by terminated command/address routing, length-matched data groups (typically within +/-25 mils per byte lane), and solid reference planes. Use on-die termination (ODT) settings per the controller's training algorithm, provide VTT termination power, and place the 78-ball FBGA close to the controller. Follow the SK hynix series datasheet's system configuration section and your SoC vendor's layout guide for trace impedance and skew budgets.
Does the H5AN4G8NBJR-VKC require refresh like all DRAM?
Yes. As a DDR4 SDRAM, the H5AN4G8NBJR-VKC is volatile and its capacitor-based cells must be refreshed periodically by the memory controller issuing REF/REFab commands, typically at an average interval of 7.8 microseconds at normal operating temperature (3.9 microseconds above 85 C per standard DDR4 refresh conventions). Exact refresh timing and self-refresh specifications for the VKC grade are defined in the SK hynix series datasheet.

Engineering reference data for H5AN4G8NBJR-VKC — comparison, design guidance, and compliance information.

Selection Guide

Choose the H5AN4G8NBJR-VKC when your memory controller supports DDR4-2666 and you want the highest-throughput grade of the SK hynix 4Gb x8 NBJR family in the standard FBGA-78 footprint. Choose H5AN4G8NBJR-UHC or -UHI if your controller runs at a lower memory clock or you need an alternate temperature suffix - they are footprint-identical and swap cleanly with firmware timing updates. Choose H5AN4G8NBJR-PBC or -RDC for cost-reduced designs where 2666 Mbps bandwidth is not required. Choose H5AN4G8NAFR-TFC only when an earlier A-die revision is explicitly on your controller's validated memory list. If you need 8Gb density instead of 4Gb, move to H5AN8G8NCJR-VKC (newer C-die generation) but verify ballout compatibility, since a different generation may change footprint requirements. Always confirm the controller's validated vendor/die list before second-sourcing any DDR4.

Comparison with Alternatives

Parameter This Product H5AN4G8NBJR-UHI H5AN4G8NBJR-UHC H5AN4G8NBJR-RDC H5AN4G8NBJR-PBC H5AN4G8NAFR-TFC
Package FBGA-78 (7.5 x 11 mm) FBGA-78 - same FBGA-78 - same FBGA-78 - same FBGA-78 - same FBGA-78 - same
Brand SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix
Memory Size 4 Gb 4 Gb 4 Gb 4 Gb 4 Gb 4 Gb
Memory Organization 512M x8 512M x8 512M x8 512M x8 512M x8 512M x8
Data Rate 2666 Mbps [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] 2666 Mbps grade family
Supply Voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Lifecycle Status Active [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]
RoHS / Halogen-Free Compliant Compliant (series datasheet) Compliant (series datasheet) Compliant (series datasheet) Compliant (series datasheet) Compliant (series datasheet)

Key Differentiators

  • Highest speed grade in the NBJR family listed here (vs H5AN4G8NBJR-PBC)
  • Newer B-die revision vs A-die predecessor (vs H5AN4G8NAFR-TFC)
  • Broad suffix-family second sourcing within one footprint (vs H5AN4G8NBJR-UHC)

Design Notes

At 2666 Mbps, DDR4 signal integrity is dominated by fly-by command/address termination and byte-lane skew. Route CA[5:0], CS, CKE, and clock in fly-by topology to each FBGA-78 device with on-die termination (ODT) enabled per the controller training algorithm. Length-match DQ/DQS groups per byte lane within the SoC vendor's tolerance (commonly +/-25 mils intra-byte) and maintain 40-ohm controlled impedance on data lines. Reference all high-speed traces to a continuous ground plane; avoid crossing plane splits under the memory bus.

The H5AN4G8NBJR-VKC requires three rails per DDR4 architecture: VDD 1.2 V core, VDDQ 1.2 V I/O, and VPP 2.5 V wordline boost. Budget a separate VTT termination regulator (e.g., sink-source LDO) for command/address and data termination, sized for peak termination current during bus turnarounds. Estimated: a 4-chip x8 32-bit-wide design at 2666 Mbps draws roughly 0.5-1.5 A per rail depending on traffic - derive from the series datasheet IDD tables for your usage pattern, not from this estimate. Place bulk 47-100 uF plus per-ball 0.1 uF decoupling close to each VDD/VDDQ ball group.

Speed-grade suffix mismatch is the most common DDR4 substitution failure: swapping a -VKC (2666) for a lower grade (e.g., -PBC) without re-programming controller CAS latency, tRCD/tRP, and refresh settings causes boot failures or intermittent memory errors. Always update SPD data and memory-training firmware when qualifying any suffix variant. Additionally, DRAM is volatile and ESD-sensitive: handle trays per JEDEC moisture/ESD handling guidance, and confirm the -C commercial temperature suffix matches your ambient specification before industrial deployment.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Unknown

Series datasheet (H5AN4GxNBJR) describes family as Lead-Free & Halogen-Free. JLCPCB listing confirms RoHS for FBGA-78 DDR SDRAM. REACH and conflict-minerals status not stated in provided data.

Data verified on: 2026-09-04 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

SK Hynix H5AN4G8NBJR-VKC H5AN4G8NBJR-UHI H5AN4G8NBJR-UHC H5AN4G8NBJR-RDC H5AN4G8NBJR-PBC H5AN4G8NAFR-TFC H5AN8G8NCJR-VKC DDR4 SDRAM DRAM volatile memory FBGA-78 FBGA package family surface mount RoHS 512M x8 organization 2666 Mbps data rate 1.2 V supply voltage UDIMM main memory JEDEC DDR4 standard on-die termination memory controller training set-top box networking line card
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