H5AN8G6NAFR-UHC vs H5AN8G6NAFR-RDC Comparison
Detailed side-by-side comparison of H5AN8G6NAFR-UHC by SK hynix and H5AN8G6NAFR-RDC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | H5AN8G6NAFR-UHC | H5AN8G6NAFR-RDC |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $5.74 | $3.05 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | — |
| Organization | 512M x 16 | 512M x 16 |
| Supply Voltage | 1.2 V | 1.2 V |
| Data Rate | 2400 MT/s | — |
| Package | FBGA-96 | — |
| Operating Temperature | 0°C to +85°C | [DATA_NEEDED: operating temperature range] |
| Number of Terminals | 96 | 96 |
| Package Code | TFBGA | TFBGA |
| Lead-Free | Yes | — |
| Halogen Free | Yes | — |
| RoHS Compliant | Yes | — |
| CAS Latency | [DATA_NEEDED: CAS Latency] | — |
| Burst Length | 8, 4 (with burst chop) | — |
| Refresh | Auto self-refresh | — |
| Memory Density | — | 8 Gb |
| Interface | — | DDR4 (JEDEC-standard) |
| Access Mode | — | Multi Bank Page Burst |
| Package Shape | — | Rectangular |
| Mounting Type | — | Surface Mount |
| Temperature Grade | — | OTHER (per Partstack listing) |
| Technology | — | CMOS |
| RoHS Status | — | Compliant (Lead-Free & Halogen-Free) |
| Speed Grade | — | -RDC (see datasheet for bin timing) |
| Family | — | H5AN8G4NAFR-xxC / H5AN8G8NAFR-xxC / H5AN8G6NAFR-xxC |
| Max Clock Rate | — | [DATA_NEEDED: max clock rate for -RDC bin] |