H5AN8G6NAFR-UHC vs H5AN8G6NAFR-RDC 对比
详细并排对比 H5AN8G6NAFR-UHC 出自 SK hynix 和 H5AN8G6NAFR-RDC 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | H5AN8G6NAFR-UHC | H5AN8G6NAFR-RDC |
|---|---|---|
| 品牌 | SK hynix | SK hynix |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $5.74 | $3.05 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | — |
| 存储组织 | 512M x 16 | 512M x 16 |
| 电源电压 | 1.2 V | 1.2 V |
| 数据速率 | 2400 MT/s | — |
| 封装 | FBGA-96 | — |
| 工作温度 | 0°C to +85°C | [DATA_NEEDED: operating temperature range] |
| Number of Terminals | 96 | 96 |
| Package Code | TFBGA | TFBGA |
| Lead-Free | Yes | — |
| 无卤 | Yes | — |
| RoHS Compliant | Yes | — |
| CAS 延迟 | [DATA_NEEDED: CAS Latency] | — |
| Burst Length | 8, 4 (with burst chop) | — |
| Refresh | Auto self-refresh | — |
| Memory Density | — | 8 Gb |
| 接口 | — | DDR4 (JEDEC-standard) |
| Access Mode | — | Multi Bank Page Burst |
| Package Shape | — | Rectangular |
| 安装类型 | — | Surface Mount |
| Temperature Grade | — | OTHER (per Partstack listing) |
| Technology | — | CMOS |
| RoHS 状态 | — | Compliant (Lead-Free & Halogen-Free) |
| Speed Grade | — | -RDC (see datasheet for bin timing) |
| Family | — | H5AN8G4NAFR-xxC / H5AN8G8NAFR-xxC / H5AN8G6NAFR-xxC |
| Max Clock Rate | — | [DATA_NEEDED: max clock rate for -RDC bin] |