H5AN8G6NAFR-UHC - 8Gb DDR4 SDRAM 512Mx16 | SK hynix
MPN: H5AN8G6NAFR-UHC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0.1944 | $0.19 |
| 10 | $0.18 | $1.80 |
| 100 | $0.16 | $16.00 |
| 500 | $0.14 | $70.00 |
| 1,000 | $0.12 | $120.00 |
Drop-in alternatives for H5AN8G6NAFR-UHC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5AN8G6NAFR-UHC
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View Datasheet →H5AN8G6NAFR-UHC
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View Datasheet →H5AN8G6NAFR-UHC
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View Datasheet →MT41K256M16HA-125
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View Datasheet →H5AN8G6NAFR-UHC Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Density | 8 Gb |
| Organization | 512M x 16 |
| Supply Voltage | 1.2 V |
| Data Rate | 2400 MT/s |
| Package | FBGA-96 |
| Operating Temperature | 0°C to +85°C |
| Number of Terminals | 96 |
| Package Code | TFBGA |
| Lead-Free | Yes |
| Halogen-Free | Yes |
| RoHS Compliant | Yes |
| CAS Latency | [DATA_NEEDED: CAS Latency] |
| Burst Length | 8, 4 (with burst chop) |
| Refresh | Auto self-refresh |
H5AN8G6NAFR-UHC Pin Configuration
| Pin A1 | VDD — Power supply (1.2V) |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin B1 | VSS — Ground |
| Pin B2 | DQ2 — Data input/output 2 |
| Pin B3 | DQ3 — Data input/output 3 |
| Pin C1 | VDDQ — Power supply for output buffers |
| Pin C2 | DQ4 — Data input/output 4 |
| Pin C3 | DQ5 — Data input/output 5 |
| Pin D1 | VSSQ — Ground for output buffers |
| Pin D2 | DQ6 — Data input/output 6 |
| Pin D3 | DQ7 — Data input/output 7 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5AN8G6NAFR-UHC is suitable for 6 applications: Server Memory Modules, Networking Equipment, Embedded Systems, High-Performance Computing, Consumer Electronics, Automotive Infotainment.
Server Memory Modules
The H5AN8G6NAFR-UHC is ideal for RDIMM and LRDIMM modules used in servers, providing high density and bandwidth for data-intensive workloads. Its 8Gb density and 2400 MT/s speed enable large memory capacity and fast data transfer, essential for cloud computing and enterprise applications. The device's low 1.2V operation reduces power consumption, improving energy efficiency in data centers. With features like CRC and write leveling, it ensures reliable operation in high-speed, multi-rank configurations.
Recommended
Networking Equipment
In networking switches and routers, the H5AN8G6NAFR-UHC provides high-bandwidth memory for packet buffering and forwarding tables. Its 2400 MT/s data rate supports line-rate processing, while the 8Gb density allows large lookup tables. The device's low power consumption is critical for dense line cards. The x16 organization simplifies PCB routing, and the FBGA-96 package offers good thermal performance in constrained environments.
Recommended
Embedded Systems
For embedded applications like industrial PCs and medical devices, the H5AN8G6NAFR-UHC offers a balance of density, speed, and power. Its 8Gb capacity supports complex applications, while the 1.2V supply reduces heat generation. The device's wide operating temperature range (0°C to +85°C) suits industrial environments. The FBGA-96 package is compact, enabling small form-factor designs. Features like auto self-refresh simplify power management in battery-powered systems.
Recommended
High-Performance Computing
In HPC systems, the H5AN8G6NAFR-UHC provides the memory bandwidth needed for scientific simulations and AI workloads. Its 2400 MT/s speed and 8Gb density enable large datasets to be processed quickly. The device's low latency and high throughput are essential for parallel processing. The x16 organization allows flexible memory configurations, and the device's reliability features (CRC, ECC support) ensure data integrity in long-running computations.
Recommended
Consumer Electronics
The H5AN8G6NAFR-UHC is used in high-end consumer devices like gaming PCs and workstations, where memory speed and capacity impact performance. Its 2400 MT/s data rate supports smooth multitasking and gaming, while the 8Gb density allows large applications. The device's low power consumption is beneficial for laptops, extending battery life. The FBGA-96 package is suitable for compact motherboards, and the device's RoHS compliance meets environmental regulations.
Recommended
Automotive Infotainment
In automotive infotainment systems, the H5AN8G6NAFR-UHC provides reliable memory for navigation, multimedia, and connectivity features. Its wide temperature range (0°C to +85°C) is suitable for cabin environments, and the device's low power consumption helps manage vehicle power budgets. The 8Gb density supports complex user interfaces, while the 2400 MT/s speed ensures responsive performance. The device's robustness and long lifecycle make it suitable for automotive applications.
Recommended
Recommended Products Summary
Engineering reference data for H5AN8G6NAFR-UHC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5AN8G6NAFR-UHC | MT41K256M16HA-125 | K4A8G165WC-BCTD |
|---|---|---|---|---|
| Package | FBGA-96 | FBGA-96 | FBGA-96 | FBGA-96 |
| Brand | SK hynix | SK hynix | Micron | Samsung |
| Density | 8 Gb | 8 Gb | 4 Gb | 8 Gb |
| Organization | 512M x 16 | 512M x 16 | 256M x 16 | 512M x 16 |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Data Rate | 2400 MT/s | 2400 MT/s | 2400 MT/s | 2666 MT/s |
| Operating Temperature | 0°C to +85°C | 0°C to +85°C | 0°C to +95°C | 0°C to +85°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Higher density than some alternatives (vs MT41K256M16HA-125)
- Lower power consumption (vs K4A8G165WC-BCTD)
- Proven reliability features (vs NT5CC256M16DP-DIH)
Design Notes
For DDR4 routing at 2400 MT/s, maintain controlled impedance of 40-50 ohms for single-ended signals and 80-100 ohms for differential pairs. Keep trace lengths matched within 10 mils for data and address/control groups. Use ground planes to minimize noise and ensure proper decoupling with 0.1uF and 1uF capacitors near each VDD and VDDQ pin.
The H5AN8G6NAFR-UHC requires a 1.2V VDD supply and a 2.5V VPP supply for wordline boost. Use low-impedance power planes and place decoupling capacitors close to the device. The VPP supply must be stable and noise-free to ensure reliable operation. Refer to the datasheet for recommended power-up sequencing.
The FBGA-96 package has a maximum operating temperature of 85°C. Ensure adequate airflow or heatsinking in high-ambient environments. The device's power dissipation depends on data rate and activity; calculate thermal budget using the datasheet's thermal resistance values. For high-density modules, consider thermal simulation.
Compliance Information
Lead-free and halogen-free per datasheet. RoHS compliant. Not AEC-Q100 qualified.
