H5AN8G6NDJR-XNC vs AS4C512M16D4A-62BIN Comparison

Detailed side-by-side comparison of H5AN8G6NDJR-XNC by SK hynix and AS4C512M16D4A-62BIN by Alliance Memory. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5AN8G6NDJR-XNC H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

H5AN8G6NDJR-XNC ✓ Active
Alliance Memory
AS4C512M16D4A-62BIN AS4C512M16D4A-62BIN - 8Gb DDR4 SDRAM 512Mx16 | Alliance Memory

AS4C512M16D4A-62BIN - 8Gb DDR4 SDRAM 512Mx16 | Alliance Memory

AS4C512M16D4A-62BIN ✓ Active

Specification Comparison

Parameter H5AN8G6NDJR-XNC AS4C512M16D4A-62BIN
Brand SK hynix Alliance Memory
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $55.68 $8.10
Memory Type DDR4 SDRAM DDR4 SDRAM
Memory Size 8 Gb 8 Gbit
Memory Organization 512M x16 —
Data Rate 3200 Mbps 3200 Mbps per pin
Supply Voltage (VDD) 1.2 V (max 1.26 V) —
Package FBGA-96 (13x7.5 mm) 96-FBGA (7.5x13mm)
Number of Terminals 96 —
Maximum Operating Temperature 85 °C —
Input/Output Type COMMON —
RoHS Compliant Compliant
Lead-Free Yes —
Halogen Free Yes —
Auto Self-Refresh Yes —
Auto Precharge Yes —
Data Mask Yes —
Dynamic On-Chip Termination Yes —
ZQ Calibration Yes —
CRC Function Yes —
Write Leveling Yes —
Asynchronous Reset Yes —
Organization — 512M x 16
Clock Rate — 1600 MHz
Supply Voltage — 1.14V ~ 1.26V (nominal 1.2V)
Operating Temperature — -40°C to +95°C
Interface — POD (Pseudo Open Drain)
CAS Latency — Programmable (e.g., 22 cycles)
Burst Length — 8 (with burst chop 4)
Refresh — Auto-refresh and self-refresh
Mounting Type — Surface Mount
Lead Free — Yes

Datasheets & Resources

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