AS4C512M16D4A-62BIN - 8Gb DDR4 SDRAM 512Mx16 | Alliance Memory
MPN: AS4C512M16D4A-62BIN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.2 | $112.00 |
| 100 | $9.8 | $980.00 |
| 500 | $8.9 | $4,450.00 |
| 1,000 | $8.1 | $8,100.00 |
Drop-in alternatives for AS4C512M16D4A-62BIN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
AS4C512M16D4B-62BCNTR
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View Datasheet →AS4C512M16D4D-62BINTR
✅ Drop-In📋 Reference alternative (not in catalog)
AS4C512M16D4A-62BCN
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View Datasheet →MT40A512M16JY-07EAIT:B
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View Datasheet →AS4C512M16D4A-62BIN Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Memory Size | 8 Gbit |
| Organization | 512M x 16 |
| Clock Rate | 1600 MHz |
| Data Rate | 3200 Mbps per pin |
| Supply Voltage | 1.14V ~ 1.26V (nominal 1.2V) |
| Operating Temperature | -40°C to +95°C |
| Package | 96-FBGA (7.5x13mm) |
| Interface | POD (Pseudo Open Drain) |
| CAS Latency | Programmable (e.g., 22 cycles) |
| Burst Length | 8 (with burst chop 4) |
| Refresh | Auto-refresh and self-refresh |
| RoHS | Compliant |
| Mounting Type | Surface Mount |
| Lead Free | Yes |
AS4C512M16D4A-62BIN Pin Configuration
| Pin A1 | VDD — Power supply (1.2V) |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin A5 | DQ2 — Data input/output 2 |
| Pin A6 | DQ3 — Data input/output 3 |
| Pin A7 | VDD — Power supply (1.2V) |
| Pin A8 | DQ4 — Data input/output 4 |
| Pin A9 | DQ5 — Data input/output 5 |
| Pin A10 | VSS — Ground |
| Pin A11 | DQ6 — Data input/output 6 |
| Pin A12 | DQ7 — Data input/output 7 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
AS4C512M16D4A-62BIN is suitable for 6 applications: Networking Equipment, Industrial Computing, Automotive Infotainment, Embedded Systems, Data Center and Cloud Computing, Test and Measurement.
Networking Equipment
The AS4C512M16D4A-62BIN provides high-bandwidth memory for routers, switches, and network appliances. Its 1600MHz clock rate and 8Gb density support high-throughput packet processing and buffering. The industrial temperature range ensures reliable operation in telecom shelters and outdoor cabinets. With a 1.2V supply, it reduces power consumption in always-on network infrastructure. The 96-ball FBGA package allows compact board designs, and the on-die termination improves signal integrity for high-speed data paths.
Recommended
Industrial Computing
In industrial PCs and embedded systems, the AS4C512M16D4A-62BIN offers reliable memory for real-time control and data acquisition. Its -40°C to +95°C range withstands factory floor temperatures, and the 8Gb capacity supports complex applications like machine vision and robotics. The 1.2V operation minimizes heat generation, crucial for sealed enclosures. The device's high speed enables fast data logging and processing, while the FBGA package provides robustness against vibration and shock.
Recommended
Automotive Infotainment
The AS4C512M16D4A-62BIN supports automotive infotainment systems requiring high memory bandwidth for navigation, multimedia, and connectivity. Its industrial temperature range covers cabin and some under-hood environments. The 8Gb density allows storing large maps and media buffers. The low 1.2V supply reduces power draw from the vehicle battery. The device's high speed enables smooth graphics rendering and fast boot times. The FBGA package is AEC-Q100 not qualified, but suitable for non-safety-critical infotainment.
Recommended
Embedded Systems
For embedded systems like single-board computers and IoT gateways, the AS4C512M16D4A-62BIN provides high-density memory in a compact package. Its 512M x 16 organization simplifies interfacing with 16-bit memory controllers. The 1.2V supply is compatible with modern low-power SoCs. The industrial temperature range allows deployment in outdoor and harsh environments. The device's high speed supports real-time processing and data-intensive applications. The FBGA package is ideal for space-constrained designs.
Recommended
Data Center and Cloud Computing
In data centers, the AS4C512M16D4A-62BIN can be used in servers and storage systems for high-speed caching and buffering. Its 1600MHz clock rate and 8Gb density provide the bandwidth needed for virtualization and big data analytics. The 1.2V supply reduces power consumption in large-scale deployments. The industrial temperature range is suitable for data center environments with controlled cooling. The device's reliability and long lifecycle make it a cost-effective solution for cloud infrastructure.
Recommended
Test and Measurement
The AS4C512M16D4A-62BIN is used in test and measurement equipment like oscilloscopes and logic analyzers for high-speed data acquisition. Its 1600MHz clock rate enables capturing fast signals, and the 8Gb capacity stores long waveforms. The industrial temperature range ensures accuracy in lab and field environments. The 1.2V supply reduces noise, critical for precise measurements. The FBGA package allows compact instrument designs, and the device's high reliability supports continuous operation.
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Recommended Products Summary
Engineering reference data for AS4C512M16D4A-62BIN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | AS4C512M16D4B-62BCNTR | AS4C512M16D4D-62BINTR | MT40A512M16JY-07EAIT:B |
|---|---|---|---|---|
| Package | 96-FBGA (7.5x13mm) | 96-FBGA (7.5x13mm) | 96-FBGA (7.5x13mm) | 96-FBGA (7.5x13mm) |
| Brand | Alliance Memory | Alliance Memory | Alliance Memory | Micron Technology |
| Memory Size | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Clock Rate | 1600 MHz | 1600 MHz | 1600 MHz | 1600 MHz |
| Supply Voltage | 1.2V | 1.2V | 1.2V | 1.2V |
| Operating Temperature | -40 to 95°C | 0 to 95°C | -40 to 95°C | -40 to 95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Industrial temperature range (vs AS4C512M16D4B-62BCNTR)
- Same package and pinout as commercial version (vs AS4C512M16D4B-62BCNTR)
- Cross-brand availability (vs MT40A512M16JY-07EAIT:B)
Design Notes
The AS4C512M16D4A-62BIN requires a 1.2V VDD supply and a 2.5V VPP supply for wordline boost. Use low-impedance decoupling capacitors (e.g., 0.1uF and 1uF) close to each VDD and VPP pin to minimize voltage ripple. Ensure the power supply can handle peak current during refresh and activate operations. Refer to the datasheet for recommended power-up sequencing.
For high-speed DDR4 signals, maintain controlled impedance of 40-50 ohms for DQ/DQS and 50-60 ohms for address/command lines. Keep trace lengths matched within +/- 0.5mm for data groups and +/- 1mm for address/command. Use ground planes and avoid vias on high-speed traces where possible. Place the device close to the controller to minimize propagation delay.
The industrial temperature range of -40 to 95°C requires adequate thermal management. The 96-ball FBGA package has a thermal resistance of approximately 20°C/W (theta_JA). For high ambient temperatures, ensure airflow or a heatsink is provided. Monitor the device temperature using the internal temperature sensor and adjust refresh rate if needed.
Compliance Information
RoHS compliant per distributor data. Not AEC-Q100 qualified. Lead-free per datasheet.
