H5ANAG6NAMR-UHC vs H5ANAG6NCJR-XNC Comparison
Detailed side-by-side comparison of H5ANAG6NAMR-UHC by SK hynix and H5ANAG6NCJR-XNC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | H5ANAG6NAMR-UHC | H5ANAG6NCJR-XNC |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $4.50 | $84.97 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Memory Density | 16 Gbit (2 GB) | — |
| Organization | 1G x 16 | — |
| Speed Grade / Data Rate | DDR4-2400 (UHC bin, PC4-19200) | — |
| Supply Voltage (VDD) | 1.2 V | — |
| Architecture | CMOS DDR4 with bank groups | — |
| Power Class | Normal Power | — |
| Package | FBGA-96 (PBGA96) | FBGA-96 |
| Mounting Type | Surface Mount (BGA solder ball) | Surface Mount |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | — |
| Refresh | Self-refresh and auto-refresh (DDR4 standard 64 ms) | — |
| CAS Latency | [DATA_NEEDED: CL for UHC bin] | — |
| Interface Type | Parallel, synchronous, double data rate | — |
| Available Speed Bins (family) | PB / RD / TF / UH / VK | — |
| Application Class | Main memory, embedded, industrial | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| Lifecycle Status | Active production | — |
| Memory Size | — | 16 Gbit |
| Memory Organization | — | 1G x 16 |
| Data Rate | — | 3200 Mbps/pin |
| Supply Voltage Range | — | 1.14 V to 1.26 V (VDD/VDDQ) |
| Interface | — | Parallel |
| Auto Self-Refresh | — | Yes |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| Data Mask Function | — | Yes |
| Dynamic On-Chip Termination (ODT) | — | Yes |
| ZQ Calibration | — | Yes |
| CRC Function | — | Yes |
| Write Leveling | — | Yes |
| Packaging | — | Tray |