H5ANAG6NBJR-VKC vs H5ANAG6NAMR-UHC Comparison
Detailed side-by-side comparison of H5ANAG6NBJR-VKC by SK hynix and H5ANAG6NAMR-UHC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | H5ANAG6NBJR-VKC | H5ANAG6NAMR-UHC |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $15.00 | $4.50 |
| Manufacturer | SK Hynix | — |
| Part Number | H5ANAG6NBJR-VKC | — |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Memory Density | 16Gb (2GB) | 16 Gbit (2 GB) |
| Organization | [DATA_NEEDED: x16 organization per datasheet] | 1G x 16 |
| Data Rate | 2666 Mbps (per family reference, VKC speed code) | — |
| Supply Voltage | 1.2 V (DDR4 standard) | — |
| Interface | DDR4, SSTL-12 | — |
| Package | FBGA-96 (PBGA96) | FBGA-96 (PBGA96) |
| Mounting Type | Surface Mount | Surface Mount (BGA solder ball) |
| Operating Temperature | -40C to +95C (family grade reference) | [DATA_NEEDED: operating temperature range] |
| Auto Self-Refresh | Yes | — |
| Data Mask Function | Yes | — |
| Asynchronous Reset | Yes | — |
| Dynamic On-Chip Termination | Yes | — |
| ZQ Calibration | Yes | — |
| Write Leveling | Yes | — |
| CRC Function | Yes | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Speed Grade / Data Rate | — | DDR4-2400 (UHC bin, PC4-19200) |
| Supply Voltage (VDD) | — | 1.2 V |
| Architecture | — | CMOS DDR4 with bank groups |
| Power Class | — | Normal Power |
| Refresh | — | Self-refresh and auto-refresh (DDR4 standard 64 ms) |
| CAS Latency | — | [DATA_NEEDED: CL for UHC bin] |
| Interface Type | — | Parallel, synchronous, double data rate |
| Available Speed Bins (family) | — | PB / RD / TF / UH / VK |
| Application Class | — | Main memory, embedded, industrial |
| Lifecycle Status | — | Active production |