H5ANAG6NCR-RDC vs H5ANAG6NAMR-UHC Comparison

Detailed side-by-side comparison of H5ANAG6NCR-RDC by SK hynix and H5ANAG6NAMR-UHC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter H5ANAG6NCR-RDC H5ANAG6NAMR-UHC
Brand SK hynix SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $72.10 $4.50
Memory Type DDR4 SDRAM DDR4 SDRAM
Memory Size 16 Gb (2 GB) —
Organization 1G x 16 1G x 16
Data Rate 3200 Mbps (PC4-25600 class) —
Supply Voltage (VDD) 1.2 V 1.2 V
Package 96-ball FBGA FBGA-96 (PBGA96)
Package Body Rectangular, 8 mm width —
Maximum Standby Current 0.074 A —
Mounting Type Surface Mount Surface Mount (BGA solder ball)
Number of Terminals (Balls) 96 —
Auto Self-Refresh Yes —
Auto Precharge Yes —
Asynchronous Reset Yes —
Data Mask (DM) Function Yes —
Dynamic On-Chip Termination (ODT) Yes —
ZQ Calibration Yes —
CRC Function Yes —
Write Leveling Yes —
RoHS Status [DATA_NEEDED: RoHS Status] [DATA_NEEDED: RoHS status]
Operating Temperature [DATA_NEEDED: Operating Temperature Range] [DATA_NEEDED: operating temperature range]
Refresh Interval [DATA_NEEDED: Refresh Interval] —
Memory Density — 16 Gbit (2 GB)
Speed Grade / Data Rate — DDR4-2400 (UHC bin, PC4-19200)
Architecture — CMOS DDR4 with bank groups
Power Class — Normal Power
Refresh — Self-refresh and auto-refresh (DDR4 standard 64 ms)
CAS Latency — [DATA_NEEDED: CL for UHC bin]
Interface Type — Parallel, synchronous, double data rate
Available Speed Bins (family) — PB / RD / TF / UH / VK
Application Class — Main memory, embedded, industrial
Lifecycle Status — Active production

Datasheets & Resources

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