H5ANAG8NAMR-UHC vs H5ANAG8NCJR-XNC Comparison

Detailed side-by-side comparison of H5ANAG8NAMR-UHC by SK hynix and H5ANAG8NCJR-XNC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5ANAG8NAMR-UHC H5ANAG8NAMR-UHC - 16Gb DDR4-2400 SDRAM 2Gx8 | SK Hynix

H5ANAG8NAMR-UHC - 16Gb DDR4-2400 SDRAM 2Gx8 | SK Hynix

H5ANAG8NAMR-UHC ✓ Active
SK hynix
H5ANAG8NCJR-XNC H5ANAG8NCJR-XNC - 16Gb DDR4-3200 SDRAM 2Gx8 | SK Hynix

H5ANAG8NCJR-XNC - 16Gb DDR4-3200 SDRAM 2Gx8 | SK Hynix

H5ANAG8NCJR-XNC ✓ Active

Specification Comparison

Parameter H5ANAG8NAMR-UHC H5ANAG8NCJR-XNC
Brand SK hynix SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $2.15 $65.63
Manufacturer SK Hynix —
Memory Type DDR4 SDRAM DDR4 SDRAM
Density 16 Gbit 16 Gbit
Organization 2G x 8 2G x 8
Data Rate DDR4-2400 (2400 MT/s) 3200 MT/s (DDR4-3200)
Supply Voltage 1.2 V —
Package FBGA-78 FBGA-78 (7.5 x 11 mm)
Mounting Type Surface Mount Surface Mount
Interface Parallel, DDR4 —
Bank Group Architecture DDR4 bank-group architecture —
On-Die Termination (ODT) Yes —
Operating Temperature [DATA_NEEDED: operating temperature range] 0C to +95C
Refresh Self-refresh and auto-refresh (DDR4) [DATA_NEEDED: refresh specification]
MSL Level [DATA_NEEDED: moisture sensitivity level] —
RoHS Status Compliant (lead-free FBGA package) Compliant
Applications Data storage, firmware boot, industrial controllers, computing modules —
Supply Voltage (VDD) — 1.2 V
Process Node — 1z nm (non-EUV)
Die Bit Density — 0.296 Gb/mm2
Peak Bandwidth (per 64-bit channel) — 25.6 GB/s at DDR4-3200
CAS Latency (CL) — [DATA_NEEDED: CAS Latency]
Base Part Number Family — H5ANAG8NCJR (16Gb DDR4 CMOS SDRAM)
Speed Grade Suffix — -XNC (0~95C commercial)

Datasheets & Resources

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