IGLR70R200D2SXUMA1 vs IGLR70R270D2SXUMA1 Comparison

Detailed side-by-side comparison of IGLR70R200D2SXUMA1 by Infineon and IGLR70R270D2SXUMA1 by Infineon. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Infineon
IGLR70R200D2SXUMA1 IGLR70R200D2SXUMA1 - 700V 9.3A GaN FET, 200mΩ | Infineon

IGLR70R200D2SXUMA1 - 700V 9.3A GaN FET, 200mΩ | Infineon

IGLR70R200D2SXUMA1 ✓ Active

Specification Comparison

Parameter IGLR70R200D2SXUMA1 IGLR70R270D2SXUMA1
Brand Infineon Infineon
Category MOSFETs MOSFETs
Lifecycle Status Active Active
Manufacturer Infineon Technologies Infineon Technologies
Product Family CoolGaN G5 CoolGaN™ G5
Channel Type N-Channel N-Channel
Technology GaN HEMT (E-mode, enhancement-mode) Gallium Nitride (GaN) HEMT, enhancement-mode
Drain-Source Voltage (VDS) 700 V 700 V
Continuous Drain Current (ID, Tc) 9.3 A 7.3 A
Power Dissipation (PD, Tc) 34 W 28 W
On-Resistance (RDS(on), max) 200 mΩ —
Total Gate Charge (Qg) 1.26 nC —
Output Capacitance (Coss) 91 pF —
Reverse Transfer Capacitance (Crss) 0.21 pF —
Gate Threshold Voltage (VGS(th), typ) 1.2 V —
Operating Temperature Range -40 °C to +150 °C -40C to +150C (junction)
Package PG-TSON-8-8 (surface mount, ThinPAK top-cooled) PG-TSON-8-8 (ThinPAK)
RoHS Compliant —
On-State Resistance (RDS(on), typ.) — 270 mΩ
Mounting Type — Surface Mount
Gate Drive — 0 to 12 V (enhancement-mode, internal gate diode)
Wafer Process — 200 mm (8-inch) GaN-on-Si
RoHS Status — Compliant
Reverse Recovery Charge (Qrr) — 0 nC (no body diode)

Datasheets & Resources

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