K4A8G085WB-BCRC vs H5AN8G8NDJR-XNC Comparison

Detailed side-by-side comparison of K4A8G085WB-BCRC by Samsung Electronics and H5AN8G8NDJR-XNC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Samsung Electronics
K4A8G085WB-BCRC K4A8G085WB-BCRC - 8Gb DDR4 SDRAM 1Gx8 2400Mbps | Samsung

K4A8G085WB-BCRC - 8Gb DDR4 SDRAM 1Gx8 2400Mbps | Samsung

K4A8G085WB-BCRC ✓ Active
SK hynix
H5AN8G8NDJR-XNC H5AN8G8NDJR-XNC - 8Gb DDR4-3200 SDRAM | SK Hynix

H5AN8G8NDJR-XNC - 8Gb DDR4-3200 SDRAM | SK Hynix

H5AN8G8NDJR-XNC ✓ Active

Specification Comparison

Parameter K4A8G085WB-BCRC H5AN8G8NDJR-XNC
Brand Samsung Electronics SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $6.80 $24.50
Memory Type DDR4 SDRAM DDR4 SDRAM
Density 8 Gb —
Organization 1G x 8 —
Data Rate 2400 Mbps 3200 MT/s (DDR4-3200)
Supply Voltage 1.2 V —
Operating Temperature 0°C to 85°C —
Package 78-ball FBGA FBGA-78 (7.5 x 11 mm)
Number of Terminals 78 —
Refresh Cycles 8192 —
Access Time 0.175 ns —
Technology CMOS —
Burst Length 8 and 4 —
On-Die Termination Yes —
Auto-Refresh Yes —
Self-Refresh Yes —
RoHS Compliant Compliant
Memory Size — 8 Gbit (1 G x 8)
Supply Voltage (VDD) — 1.14 V to 1.26 V (nominal 1.2 V)
I/O Voltage (VDDQ) — 1.14 V to 1.26 V (nominal 1.2 V)
Operating Temperature (TC) — 0°C to +95°C
Mounting Type — Surface Mount
Memory Organization — 1G x 8
Interface — Parallel
Clock Frequency — 1.6 GHz (I/O clock)
Lead-Free — Yes
Packaging — Tray
Status — Active

Datasheets & Resources

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