K4A8G085WB-BCRC vs H5AN8G8NDJR-XNC 对比

详细并排对比 K4A8G085WB-BCRC 出自 Samsung Electronics 和 H5AN8G8NDJR-XNC 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K4A8G085WB-BCRC K4A8G085WB-BCRC - 8Gb DDR4 SDRAM 1Gx8 2400Mbps | Samsung

K4A8G085WB-BCRC - 8Gb DDR4 SDRAM 1Gx8 2400Mbps | Samsung

K4A8G085WB-BCRC ✓ 量产中
SK hynix
H5AN8G8NDJR-XNC H5AN8G8NDJR-XNC - 8Gb DDR4-3200 SDRAM | SK Hynix

H5AN8G8NDJR-XNC - 8Gb DDR4-3200 SDRAM | SK Hynix

H5AN8G8NDJR-XNC ✓ 量产中

规格对比

参数 K4A8G085WB-BCRC H5AN8G8NDJR-XNC
品牌 Samsung Electronics SK hynix
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $6.80 $24.50
存储器类型 DDR4 SDRAM DDR4 SDRAM
Density 8 Gb —
存储组织 1G x 8 —
数据速率 2400 Mbps 3200 MT/s (DDR4-3200)
电源电压 1.2 V —
工作温度 0°C to 85°C —
封装 78-ball FBGA FBGA-78 (7.5 x 11 mm)
Number of Terminals 78 —
Refresh Cycles 8192 —
Access Time 0.175 ns —
Technology CMOS —
Burst Length 8 and 4 —
On-Die Termination Yes —
Auto-Refresh Yes —
Self-Refresh Yes —
RoHS Compliant Compliant
存储容量 — 8 Gbit (1 G x 8)
Supply Voltage (VDD) — 1.14 V to 1.26 V (nominal 1.2 V)
I/O Voltage (VDDQ) — 1.14 V to 1.26 V (nominal 1.2 V)
Operating Temperature (TC) — 0°C to +95°C
安装类型 — Surface Mount
Memory Organization — 1G x 8
接口 — Parallel
Clock Frequency — 1.6 GHz (I/O clock)
Lead-Free — Yes
Packaging — Tray
Status — Active

数据手册与资源

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