SK hynix

H5AN8G8NDJR-XNC - 8Gb DDR4-3200 SDRAM | SK Hynix

Name: H5AN8G8NDJR-XNC
Brand: SK Hynix
Price: 24.5 USD
Availability: InStock

MPN: H5AN8G8NDJR-XNC ✓ Active

In Stock Ships in 1-3 business days

1.14 V to 1.26 V (nominal 1.2 V) Vdss FBGA-78 (7.5 x 11 mm) Package 1.6 GHz (I/O clock) Speed DDR4 SDRAM Memory

From $24.5 USD / Unit

MOQ: 1 |

Price updated: 2026-08-20

Volume Pricing

Qty	Unit Price	Extended
1	$31.28	$31.28
10	$29.5	$295.00
100	$27.8	$2,780.00
500	$26.1	$13,050.00
1,000	$24.5	$24,500.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for H5AN8G8NDJR-XNC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

H5AN8G6NDJR-XNC

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H5AN8G8NDJR-XNC Maximum Ratings & Electrical Characteristics

Memory Type	DDR4 SDRAM
Memory Size	8 Gbit (1 G x 8)
Data Rate	3200 MT/s (DDR4-3200)
Supply Voltage (VDD)	1.14 V to 1.26 V (nominal 1.2 V)
I/O Voltage (VDDQ)	1.14 V to 1.26 V (nominal 1.2 V)
Operating Temperature (TC)	0°C to +95°C
Package	FBGA-78 (7.5 x 11 mm)
Mounting Type	Surface Mount
Memory Organization	1G x 8
Interface	Parallel
Clock Frequency	1.6 GHz (I/O clock)
RoHS	Compliant
Lead-Free	Yes
Packaging	Tray
Status	Active

H5AN8G8NDJR-XNC Pin Configuration

Pin A1	VDD — Power supply
Pin A2	DQ0 — Data input/output 0
Pin A3	DQ1 — Data input/output 1
Pin A4	VSS — Ground
Pin A5	DQ2 — Data input/output 2
Pin A6	DQ3 — Data input/output 3
Pin A7	VDDQ — I/O power supply
Pin A8	DQ4 — Data input/output 4
Pin A9	DQ5 — Data input/output 5
Pin A10	VSS — Ground
Pin A11	DQ6 — Data input/output 6
Pin A12	DQ7 — Data input/output 7
Pin A13	VDD — Power supply
Pin B1	VSS — Ground
Pin B2	DQS_t — Data strobe (true)
Pin B3	DQS_c — Data strobe (complement)
Pin B4	VDDQ — I/O power supply
Pin B5	DM_n — Data mask (active low)
Pin B6	VSS — Ground
Pin B7	VDDQ — I/O power supply
Pin B8	DQS_t — Data strobe (true)
Pin B9	DQS_c — Data strobe (complement)
Pin B10	VSS — Ground
Pin B11	DM_n — Data mask (active low)
Pin B12	VDDQ — I/O power supply
Pin B13	VSS — Ground

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

H5AN8G8NDJR-XNC is suitable for 6 applications: Personal Computers, Servers, Networking Equipment, Embedded Systems, Automotive Infotainment, Data Storage.

🖥️

Personal Computers

The H5AN8G8NDJR-XNC is ideal for PC main memory, providing 8Gb density and 3200MT/s speed for smooth multitasking and gaming. Its 1.2V operation reduces power consumption, extending battery life in laptops. The x8 organization allows for flexible memory module designs, and the FBGA-78 package enables compact PCB layouts. With a wide temperature range, it is reliable for consumer electronics.

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Servers

In servers, the H5AN8G8NDJR-XNC provides high-density, high-bandwidth memory for data-intensive applications. Its 3200MT/s data rate and 8Gb capacity support virtualization, cloud computing, and big data analytics. The device's low power consumption helps reduce total system power, and its reliability ensures 24/7 operation. The x8 organization is commonly used in server memory modules (RDIMMs, LRDIMMs).

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MT40A1G8SA-062E · Micron Technology

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Networking Equipment

The H5AN8G8NDJR-XNC is used in routers, switches, and firewalls for packet buffering and routing tables. Its high speed and low latency are critical for network throughput. The 8Gb density allows for large forwarding tables, and the 1.2V operation reduces power in always-on equipment. The FBGA-78 package is suitable for space-constrained network line cards.

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🏭

Embedded Systems

For embedded systems like industrial controllers and medical devices, the H5AN8G8NDJR-XNC offers reliable, high-speed memory. Its wide temperature range (0-95°C) suits industrial environments. The 8Gb density supports complex applications, and the low power consumption is ideal for battery-powered devices. The x8 interface simplifies connection to embedded processors.

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Automotive Infotainment

The H5AN8G8NDJR-XNC is suitable for automotive infotainment systems, providing high-speed memory for navigation, multimedia, and connectivity. Its 3200MT/s data rate ensures smooth performance, and the 1.2V operation reduces power in vehicles. The device's reliability and temperature range make it suitable for automotive environments, though AEC-Q100 qualification should be verified.

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Data Storage

In data storage systems like SSDs and NAS, the H5AN8G8NDJR-XNC is used for caching and buffering. Its high speed and low latency improve data access times. The 8Gb density provides ample cache capacity, and the low power consumption is beneficial for always-on storage devices. The FBGA-78 package is suitable for compact storage controllers.

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MT40A1G8SA-062E · Micron Technology

Recommended Products Summary

K4A8G085WB-BCRC Samsung Electronics Used in: Personal Computers, Networking Equipment, Automotive Infotainment MT40A1G8SA-062E Micron Technology Used in: Servers, Embedded Systems, Data Storage

What is the memory size and organization of H5AN8G8NDJR-XNC?

The H5AN8G8NDJR-XNC is an 8Gb DDR4 SDRAM organized as 1G x 8. According to SK Hynix datasheet, it has a memory capacity of 8 Gigabits and a data organization of 1G words by 8 bits. This configuration is commonly used in memory modules and embedded systems requiring high density.

What is the data rate of H5AN8G8NDJR-XNC?

The H5AN8G8NDJR-XNC operates at a data rate of 3200 MT/s (DDR4-3200, PC4-25600). This is the maximum data transfer rate supported by the device, as indicated in the datasheet. It is suitable for high-performance computing applications.

What is the operating temperature range of H5AN8G8NDJR-XNC?

The H5AN8G8NDJR-XNC has an operating temperature range of 0°C to +95°C (TC). This is the case temperature range specified in the datasheet. It is suitable for commercial and industrial applications within this range.

What is the supply voltage for H5AN8G8NDJR-XNC?

The H5AN8G8NDJR-XNC operates with a supply voltage (VDD) of 1.2V nominal, with a range of 1.14V to 1.26V. The I/O voltage (VDDQ) is also 1.2V nominal. This low voltage helps reduce power consumption compared to earlier DDR generations.

What package is H5AN8G8NDJR-XNC available in?

The H5AN8G8NDJR-XNC is available in a 78-ball FBGA package with dimensions of 7.5mm x 11mm. This surface-mount package is designed for high-density PCB layouts and is RoHS compliant.

Is H5AN8G8NDJR-XNC RoHS compliant?

Yes, the H5AN8G8NDJR-XNC is RoHS compliant. According to the datasheet and distributor listings, it meets the Restriction of Hazardous Substances directive, making it suitable for use in various electronic products.

What are the key features of H5AN8G8NDJR-XNC?

The H5AN8G8NDJR-XNC features auto self-refresh, auto precharge, asynchronous reset, data mask, dynamic on-chip termination, ZQ calibration, write leveling, and CRC. These features enhance performance and data integrity in high-speed memory systems.

Where can I buy H5AN8G8NDJR-XNC?

The H5AN8G8NDJR-XNC is available from distributors such as LCSC, JLCPCB, and Octopart. As of 2026-08-20, LCSC lists it at $31.2838, and Octopart shows stock of 15,980 pcs. You can order from these distributors or request a quote from other suppliers.

What is the price of H5AN8G8NDJR-XNC?

As of 2026-08-20, the price of H5AN8G8NDJR-XNC is approximately $31.28 for a single unit at LCSC. Prices may vary by distributor and quantity. For bulk orders, it is advisable to contact distributors for volume pricing.

What is the lead time for H5AN8G8NDJR-XNC?

The lead time for H5AN8G8NDJR-XNC depends on the distributor and stock availability. As of 2026-08-20, Octopart reports 15,980 pcs in stock, and Wolfchip shows 23,755 pcs in stock. If in stock, it can ship immediately; otherwise, lead time may be several weeks.

Is H5AN8G8NDJR-XNC in stock?

Yes, as of 2026-08-20, the H5AN8G8NDJR-XNC is in stock at multiple distributors. Octopart reports 15,980 pcs, and Wolfchip shows 23,755 pcs. Availability can change, so check current stock on distributor websites.

H5AN8G8NDJR-XNC vs H5AN8G6NDJR-XNC: which is better for my application?

The H5AN8G8NDJR-XNC is organized as 1G x 8, while the H5AN8G6NDJR-XNC is organized as 1G x 16. The x8 version is better for systems that require more banks or wider data buses, while the x16 version is better for lower pin count and simpler routing. Choose based on your memory controller's data bus width.

What is the difference between H5AN8G8NDJR-XNC and H5AN8G8NCJR-XNC?

The H5AN8G8NDJR-XNC and H5AN8G8NCJR-XNC are both 8Gb DDR4 SDRAM with x8 organization, but they differ in speed grade and temperature range. The NDJR-XNC supports 3200MT/s and 0-95°C, while the NCJR-XNC supports 0-85°C and likely a lower speed. Verify the exact specifications from the datasheet.

When should I choose H5AN8G8NDJR-XNC over K4A8G085WB-BCRC?

Choose H5AN8G8NDJR-XNC if you prefer SK Hynix's reliability and availability, or if your design is optimized for SK Hynix's timing parameters. The K4A8G085WB-BCRC is a Samsung equivalent with similar specs. Both are 8Gb DDR4-3200 x8, so the choice may come down to supply chain and cost.

What is the best drop-in replacement for H5AN8G8NDJR-XNC?

The best drop-in replacement for H5AN8G8NDJR-XNC is the Samsung K4A8G085WB-BCRC or Micron MT40A1G8SA-062E, both 8Gb DDR4-3200 x8 in FBGA-78 package. These are pin-compatible and electrically similar. Verify timing and temperature specs before substitution.

Can K4A8G085WB-BCRC replace H5AN8G8NDJR-XNC?

Yes, the Samsung K4A8G085WB-BCRC can replace H5AN8G8NDJR-XNC as it is an 8Gb DDR4-3200 x8 device in the same FBGA-78 package. It is pin-compatible and has similar electrical characteristics. However, verify the timing parameters and temperature range to ensure compatibility with your design.

Where can I download the H5AN8G8NDJR-XNC datasheet PDF?

You can download the H5AN8G8NDJR-XNC datasheet PDF from LCSC at https://www.lcsc.com/datasheet/C20625716.pdf. Additionally, the SK Hynix product page provides datasheets for their DDR4 products. Always refer to the official datasheet for accurate specifications.

Where can I find the H5AN8G8NDJR-XNC pinout?

The H5AN8G8NDJR-XNC pinout is available in the official datasheet from SK Hynix. You can download it from LCSC or the SK Hynix website. The pinout diagram shows the 78-ball FBGA package with ball assignments for address, data, control, and power pins.

Hey Google, what can replace H5AN8G8NDJR-XNC?

The H5AN8G8NDJR-XNC can be replaced by Samsung K4A8G085WB-BCRC, Micron MT40A1G8SA-062E, or Nanya NT5AD1024M8A3-GK. These are 8Gb DDR4-3200 x8 devices in FBGA-78 package. Ensure pin compatibility and verify timing parameters before replacement.

Is H5AN8G8NDJR-XNC the same as H5AN8G6NDJR-XNC?

No, they are not the same. The H5AN8G8NDJR-XNC has x8 data organization (1G x 8), while the H5AN8G6NDJR-XNC has x16 organization (1G x 16). They have different pinouts and are not pin-compatible. Choose based on your memory bus width.

What are the key specifications of H5AN8G8NDJR-XNC that engineers should know?

The H5AN8G8NDJR-XNC is an 8Gb DDR4 SDRAM with 1G x 8 organization, 3200MT/s data rate, 1.2V supply, FBGA-78 package, and 0-95°C operating temperature. It supports auto self-refresh, ZQ calibration, write leveling, and CRC. These specs are critical for memory design.

What is the best Samsung equivalent for H5AN8G8NDJR-XNC?

The best Samsung equivalent for H5AN8G8NDJR-XNC is the K4A8G085WB-BCRC, which is an 8Gb DDR4-3200 x8 device in FBGA-78 package. It is pin-compatible and has similar electrical characteristics. Verify timing and temperature specs before substitution.

Engineering reference data for H5AN8G8NDJR-XNC — comparison, design guidance, and compliance information.

Selection Guide

Choose the H5AN8G8NDJR-XNC when you need an 8Gb DDR4-3200 x8 memory IC with a wide temperature range (0-95°C) and proven reliability. It is ideal for PCs, servers, networking, and embedded systems. If you require a lower temperature range (0-85°C) and can accept a lower speed grade, the H5AN8G8NCJR-XNC is a cost-effective alternative. For x16 organization, consider the H5AN8G6NDJR-XNC, but note it is not pin-compatible. Cross-brand equivalents like Samsung K4A8G085WB-BCRC and Micron MT40A1G8SA-062E offer similar specs and can be used as drop-in replacements, but verify timing and temperature specifications. For automotive applications, ensure the part is AEC-Q100 qualified, which is not specified for this device.

Comparison with Alternatives

Parameter	This Product	H5AN8G6NDJR-XNC	H5AN8G8NCJR-XNC	K4A8G085WB-BCRC	MT40A1G8SA-062E	NT5AD1024M8A3-GK
Package	FBGA-78	FBGA-78	FBGA-78	FBGA-78	FBGA-78	FBGA-78
Brand	SK Hynix	SK Hynix	SK Hynix	Samsung	Micron	Nanya
Memory Size	8 Gb	8 Gb	8 Gb	8 Gb	8 Gb	8 Gb
Data Rate	3200 MT/s	3200 MT/s	[DATA_NEEDED]	3200 MT/s	3200 MT/s	3200 MT/s
Supply Voltage	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
Operating Temperature	0 to 95°C	0 to 95°C	0 to 85°C	[DATA_NEEDED]	[DATA_NEEDED]	[DATA_NEEDED]
Memory Organization	1G x 8	1G x 16	1G x 8	1G x 8	1G x 8	1G x 8
RoHS	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant

Key Differentiators

Wide temperature range (0-95°C) (vs H5AN8G8NCJR-XNC)
x8 organization for flexible design (vs H5AN8G6NDJR-XNC)
Proven SK Hynix reliability (vs K4A8G085WB-BCRC)

Design Notes

For DDR4-3200 operation, ensure controlled impedance traces (typically 40-50 ohms) for DQ, DQS, and address/command lines. Keep trace lengths matched within 50 mils to minimize skew. Place decoupling capacitors (0.1uF and 1uF) close to VDD and VDDQ pins to reduce power supply noise.

The H5AN8G8NDJR-XNC is rated for 0-95°C case temperature. Ensure adequate airflow or heatsinking in high-ambient environments. Monitor the case temperature during operation to avoid exceeding the maximum rating, which could cause data corruption or device failure.

Use proper termination (e.g., ODT) and reference voltage (VREF) generation for the I/O. Follow the datasheet's recommended VREF training sequence. For high-speed signals, use via stitching and ground planes to reduce EMI and crosstalk.

Compliance Information

RoHS

Compliant

REACH

Unknown

AEC-Q100

Not Applicable

Lead Free

Yes

Halogen Free

Unknown

Conflict Minerals

Unknown

RoHS compliant per datasheet and distributor listings. AEC-Q100 qualification not specified.

Data verified on: 2026-08-20

Sources: Distributor, Distributor, Octopart, Manufacturer_Datasheet, Distributor, Manufacturer_Datasheet, Distributor, Distributor, Distributor, Manufacturer_Datasheet