K4A8G085WB-BCTD vs K4A8G085WB-BITD Comparison
Detailed side-by-side comparison of K4A8G085WB-BCTD by Samsung Electronics and K4A8G085WB-BITD by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4A8G085WB-BCTD
K4A8G085WB-BCTD - 8Gb DDR4 SDRAM 1Gx8 | Samsung | FBGA-78
K4A8G085WB-BCTD β ActiveSamsung Electronics
K4A8G085WB-BITD
K4A8G085WB-BITD - 8Gb DDR4 SDRAM 2666Mbps | Samsung
K4A8G085WB-BITD β ActiveSpecification Comparison
| Parameter | K4A8G085WB-BCTD | K4A8G085WB-BITD |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7.50 | $3.80 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Memory Size | 8 Gb (1G x 8) | β |
| Supply Voltage | 1.2 V | 1.2 V |
| Data Rate | 3200 Mbps (PC4-25600) | 2666 Mbps |
| Speed Bin | CL22-22-22 | β |
| Package | FBGA-78 (TFBGA) | 78FBGA |
| Operating Temperature | 0Β°C to +95Β°C (TC) | -40Β°C to +95Β°C |
| Burst Length | 8 (BL8) | β |
| On-Die Termination | Yes (ODT) | β |
| ZQ Calibration | Yes | β |
| Auto Precharge | Yes | β |
| Asynchronous Reset | Yes | β |
| CRC Function | Yes | β |
| Dynamic On-Chip Termination | Yes | β |
| Data Mask Function | Yes | β |
| JESD-30 Code | R-PBGA-B78 | β |
| Number of Terminals | 78 | β |
| RoHS Status | Compliant | Compliant |
| Density | β | 8 Gb |
| Organization | β | 1G x 8 |
| Mounting Type | β | Surface Mount |
| Number of Pins | β | 78 |
| CAS Latency | β | [DATA_NEEDED: CAS Latency] |
| Row Cycle Time (tRC) | β | [DATA_NEEDED: tRC] |
| Refresh Cycle Time (tRFC) | β | [DATA_NEEDED: tRFC] |
| Interface | β | Parallel |
| Lead-Free | β | Yes |