K4A8G165WC-BCTD vs K4A8G165WB-BCPB Comparison
Detailed side-by-side comparison of K4A8G165WC-BCTD by Samsung Electronics and K4A8G165WB-BCPB by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4A8G165WC-BCTD - 8Gb DDR4 SDRAM 512Mx16 2666Mbps | Samsung
K4A8G165WC-BCTD ✓ ActiveSamsung Electronics
K4A8G165WB-BCPB - 8Gb DDR4 SDRAM x16 2133Mbps | Samsung
K4A8G165WB-BCPB ✓ ActiveSpecification Comparison
| Parameter | K4A8G165WC-BCTD | K4A8G165WB-BCPB |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $41.20 | $2.30 |
| Memory Type | DDR4 SDRAM | — |
| Density | 8 Gb | 8 Gb |
| Organization | 512M x 16 | 512M x 16 |
| Data Rate | 2666 Mbps (DDR4-2666) | — |
| Supply Voltage | 1.2 V | 1.2 V (1.14 V to 1.26 V) |
| Operating Voltage Range | 1.14 V to 1.26 V | — |
| Clock Frequency | 1.333 GHz | — |
| Operating Temperature | 0C to +95C | 0°C to 85°C |
| Package | 96FBGA (96-ball Fine-Pitch Ball Grid Array) | 96-ball FBGA (TFBGA-96) |
| Mounting Type | Surface Mount | — |
| Die Revision | C-die | — |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| CRC Function | Yes | — |
| ZQ Calibration | Yes (240 ohm resistor to GND) | — |
| Dynamic On-Chip Termination (ODT) | Yes | — |
| Data Mask Function | Yes | — |
| RoHS Status | Compliant | Compliant |
| Speed Grade | — | 2133 Mbps (PC4-17000) |
| Burst Length | — | 8 (BL8) |
| Burst Type | — | Sequential and Interleave |
| CAS Latency | — | Programmable (e.g., 15, 16, 18) |
| Refresh | — | Auto and Self Refresh |
| Number of Terminals | — | 96 |
| Package Code | — | TFBGA |
| Package Shape | — | RECTANGULAR |
| Terminal Position | — | BOTTOM |