K4AAG165WA-BCTD vs K4AAG165WA-BCWE Comparison
Detailed side-by-side comparison of K4AAG165WA-BCTD by Samsung Electronics and K4AAG165WA-BCWE by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | K4AAG165WA-BCTD | K4AAG165WA-BCWE |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $60.59 | $62.40 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Memory Size | 16 Gb | 16 Gb (2 GB) |
| Memory Organization | 1G x 16 | 1G x 16 |
| Data Rate | 2666 Mbps | 3200 Mbps (DDR4-3200) |
| Supply Voltage | 1.2 V | 1.2 V |
| Interface | Synchronous, DDR4 | — |
| Operating Temperature | 0C to +85C | -40C to +95C |
| Package | 96-FBGA | 96-ball FBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Memory Format | Volatile (DRAM) | DRAM (Volatile) |
| Bank Architecture | DDR4 bank-group architecture | — |
| Technology Family | DDR4 SDRAM (Samsung K4AAG165WA series) | — |
| Application Class | Computing, embedded, consumer main memory | — |
| Package Family | FBGA -> fine-pitch BGA -> surface mount | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Package Dimensions | — | 13 x 9 mm |
| Ball Pitch | — | 0.8 mm |
| Interface Type | — | Parallel, DDR4 |
| Technology | — | DDR4 SDRAM, 8n prefetch, bank group architecture |
| Packaging | — | Tray |
| Product Status | — | Active |