K4AAG165WA-BCTD vs K4AAG165WA-BCWE 对比
详细并排对比 K4AAG165WA-BCTD 出自 Samsung Electronics 和 K4AAG165WA-BCWE 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4AAG165WA-BCTD | K4AAG165WA-BCWE |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $60.59 | $62.40 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| 存储容量 | 16 Gb | 16 Gb (2 GB) |
| Memory Organization | 1G x 16 | 1G x 16 |
| 数据速率 | 2666 Mbps | 3200 Mbps (DDR4-3200) |
| 电源电压 | 1.2 V | 1.2 V |
| 接口 | Synchronous, DDR4 | — |
| 工作温度 | 0C to +85C | -40C to +95C |
| 封装 | 96-FBGA | 96-ball FBGA |
| 安装类型 | Surface Mount | Surface Mount |
| Memory Format | Volatile (DRAM) | DRAM (Volatile) |
| Bank Architecture | DDR4 bank-group architecture | — |
| Technology Family | DDR4 SDRAM (Samsung K4AAG165WA series) | — |
| Application Class | Computing, embedded, consumer main memory | — |
| Package Family | FBGA -> fine-pitch BGA -> surface mount | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| MSL 等级 | [DATA_NEEDED: moisture sensitivity level] | — |
| Package Dimensions | — | 13 x 9 mm |
| Ball Pitch | — | 0.8 mm |
| 接口类型 | — | Parallel, DDR4 |
| Technology | — | DDR4 SDRAM, 8n prefetch, bank group architecture |
| Packaging | — | Tray |
| Product Status | — | Active |