K4RHE086VB-BCWM vs K4RAH086VP-BCWM Comparison
Detailed side-by-side comparison of K4RHE086VB-BCWM by Samsung Electronics and K4RAH086VP-BCWM by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | K4RHE086VB-BCWM | K4RAH086VP-BCWM |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7.65 | $0.00 |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM |
| Density | 24 Gb | — |
| Organization | 2G x 8 | — |
| Data Rate | 5600 Mbps | 5600 Mbps/pin |
| Supply Voltage | 1.1 V | 1.1 V |
| Package | 82 FBGA | [DATA_NEEDED: exact FBGA package code and body size] |
| Mounting Type | Surface Mount | Surface Mount |
| Interface | DDR5 (JEDEC) | Parallel |
| Configuration | x8 | — |
| Application Segment | Server / Data Center / Premium PC | Industrial |
| Manufacturer | Samsung Semiconductor | — |
| RoHS Status | unknown | unknown |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Access Time / CAS Latency | [DATA_NEEDED: CAS latency] | — |
| On-Die ECC | [DATA_NEEDED: on-die ECC support] | — |
| Package Height | [DATA_NEEDED: package height] | — |
| Memory Size | — | 16 Gb |
| Memory Organization | — | 2G x 8 |
| Technology | — | DRAM DDR5 |
| Memory Format | — | DRAM |
| Volatile / Non-Volatile | — | Volatile |
| Packaging | — | Tray |
| Lifecycle Status | — | Active |
| MSL Level | — | [DATA_NEEDED: moisture sensitivity level] |