K4RHE086VB-BCWM vs K4RAH086VP-BCWM 对比
详细并排对比 K4RHE086VB-BCWM 出自 Samsung Electronics 和 K4RAH086VP-BCWM 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4RHE086VB-BCWM | K4RAH086VP-BCWM |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $7.65 | $0.00 |
| 存储器类型 | DDR5 SDRAM | DDR5 SDRAM |
| Density | 24 Gb | — |
| 存储组织 | 2G x 8 | — |
| 数据速率 | 5600 Mbps | 5600 Mbps/pin |
| 电源电压 | 1.1 V | 1.1 V |
| 封装 | 82 FBGA | [DATA_NEEDED: exact FBGA package code and body size] |
| 安装类型 | Surface Mount | Surface Mount |
| 接口 | DDR5 (JEDEC) | Parallel |
| Configuration | x8 | — |
| Application Segment | Server / Data Center / Premium PC | Industrial |
| Manufacturer | Samsung Semiconductor | — |
| RoHS 状态 | unknown | unknown |
| 工作温度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Access Time / CAS Latency | [DATA_NEEDED: CAS latency] | — |
| On-Die ECC | [DATA_NEEDED: on-die ECC support] | — |
| Package Height | [DATA_NEEDED: package height] | — |
| 存储容量 | — | 16 Gb |
| Memory Organization | — | 2G x 8 |
| Technology | — | DRAM DDR5 |
| Memory Format | — | DRAM |
| Volatile / Non-Volatile | — | Volatile |
| Packaging | — | Tray |
| 生命周期状态 | — | Active |
| MSL 等级 | — | [DATA_NEEDED: moisture sensitivity level] |