K4RAH086VP-BCWM - 16Gb DDR5 5600Mbps DRAM | Samsung
MPN: K4RAH086VP-BCWM ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for K4RAH086VP-BCWM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K4RAH086VB-BIWM
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View Datasheet →K4RAH086VB-BCWM
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View Datasheet →K4RAH086VE-BCWM
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View Datasheet →K4RAH086VP-BCWM Maximum Ratings & Electrical Characteristics
| Memory Type | DDR5 SDRAM |
| Memory Size | 16 Gb |
| Memory Organization | 2G x 8 |
| Data Rate | 5600 Mbps/pin |
| Supply Voltage | 1.1 V |
| Interface | Parallel |
| Technology | DRAM DDR5 |
| Memory Format | DRAM |
| Volatile / Non-Volatile | Volatile |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| Application Segment | Industrial |
| Lifecycle Status | Active |
| RoHS Status | unknown |
K4RAH086VP-BCWM [data_needed: exact fbga package code and body size] Pin Configuration Guide
Complete pinout information for K4RAH086VP-BCWM ([data_needed: exact fbga package code and body size] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
![[data_needed: exact fbga package code and body size] package pinout diagram for K4RAH086VP-BCWM](/assets/package-diagrams/default.svg?v=1788069619)
No detailed pinout data available for K4RAH086VP-BCWM.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4RAH086VP-BCWM is suitable for 6 applications: Industrial Servers and Storage Controllers, Embedded Computing and Edge Modules, Networking and Communication Equipment, Data Acquisition and Test Instrumentation, AI Inference at the Edge, Automated Test and Burn-In Systems.
Industrial Servers and Storage Controllers
Industrial servers and storage controllers demand main memory that combines high bandwidth with reliability under extended operating conditions. The Samsung K4RAH086VP-BCWM fits this role with its 16 Gb density, 5600 Mbps/pin DDR5 transfer rate, and 1.1 V supply; the x8 organization allows flexible bus widths when multiple components populate a channel. IBS Electronics explicitly positions this part for industrial applications. In a typical design, eight components form a 64-bit channel delivering roughly 4.5 GB/s per component (DDR5-5600 x8), while the lower 1.1 V rail reduces dynamic power versus DDR4 1.2 V solutions. DDR5's on-die features reduce controller load in RAID and caching workloads, and the industrial speed-grade suffix supports the thermal and longevity expectations of 24/7 factory-floor servers.
Recommended
Embedded Computing and Edge Modules
Embedded computing modules (COM Express, SMARC, custom SBCs) require compact, high-density DRAM components to deliver server-like bandwidth in constrained form factors. The K4RAH086VP-BCWM provides 16 Gb per component organized as 2G x 8 at 5600 Mbps, letting a single 64-bit channel reach 32 GB with sixteen components, or 16 GB with eight. The 1.1 V operating voltage lowers both heat generation and power budget, which is critical for fanless edge enclosures. DDR5's split CA bus and on-die features simplify routing in dense stacked-module designs. Designers should pair the DRAM with a DDR5-capable SoC and a compliant PMIC, and follow Samsung's length-matching rules; the industrial temperature positioning of this part suits outdoor gateways, machine vision, and in-vehicle compute where consumer-grade memory would be marginal.
Recommended
Networking and Communication Equipment
Routers, switches, and 5G network appliances rely on DRAM for packet buffers, flow tables, and control-plane software. The K4RAH086VP-BCWM's 5600 Mbps/pin data rate and 16 Gb density provide the throughput headroom for line-rate packet processing, while the x8 organization supports the 64-bit and 72-bit (with ECC) buses common in networking ASICs. Because network equipment runs continuously, the 1.1 V supply meaningfully reduces per-component idle and active power compared with DDR4 parts at the same bandwidth. In buffer-memory subsystems, place the DRAM components close to the ASIC with per-byte trace-length matching within the datasheet skew budget, and configure on-die termination to match the stackup impedance. Industrial-grade positioning of this Samsung part aligns with telecom central-office and outdoor-cabinet temperature expectations.
Recommended
Data Acquisition and Test Instrumentation
High-speed data acquisition systems and test instruments stream ADC data into large memory buffers, demanding both capacity and sustained write bandwidth. A single K4RAH086VP-BCWM offers 16 Gb (2 GB) per component at 5600 Mbps per pin, so an eight-deep x8 bank achieves 16 GB with approximately 36 GB/s aggregate theoretical bandwidth before protocol overhead - sufficient to buffer multi-GSPS ADC streams. The 1.1 V rail limits local heating in dense instrument chassis. In these designs, the DRAM controller typically lives in an FPGA; verify DDR5 training support and use Samsung's write-leveling and read-training sequences. Choose this industrial-suffix part over commodity desktop DRAM because instrument vendors require long-term supply continuity and characterized operation across the full commercial-industrial temperature span.
Recommended
AI Inference at the Edge
Edge AI appliances for vision inspection and video analytics need fast main memory to feed accelerators with model weights and frame buffers. The K4RAH086VP-BCWM delivers 16 Gb per component at 5600 Mbps, and a dual-channel design (16 x8 components, 4 GB each bank) provides tens of GB/s of sustained bandwidth - a practical fit for NPU or GPU SoCs streaming ResNet- or transformer-class models. The 2G x 8 organization and standard DDR5 parallel interface allow direct attachment to DDR5 host controllers without PHY bridges, reducing latency versus buffered module solutions. Power-sensitive edge enclosures benefit from the 1.1 V operation, which cuts DRAM subsystem power by roughly 8% at equal bandwidth versus DDR4 1.2 V. Follow Samsung's Vref and termination guidance for clean eye diagrams at full speed.
Recommended
Automated Test and Burn-In Systems
Memory burn-in handlers and ATE load boards must exercise DDR5 components at full speed while monitoring parametric behavior. The K4RAH086VP-BCWM serves both as a device under test target class and as on-board reference memory in system-level test (SLT) fixtures, thanks to its mainstream 16 Gb x8 DDR5-5600 configuration that matches high-volume production memory. Its tray packaging simplifies automated pick-and-place into burn-in boards. Test engineers should account for the 1.1 V supply tolerance window and per-pin 5600 Mbps signaling when calibrating driver strengths and termination on the load board, and should verify the speed-bin suffix code so burn-in profiles match the qualified grade. Stock depth of 40,000+ pcs across distributors as of September 2026 supports volume test-house procurement.
Recommended
Recommended Products Summary
Engineering reference data for K4RAH086VP-BCWM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4RAH086VB-BIWM | K4RAH086VB-BCWM | K4RAH086VE-BCWM |
|---|---|---|---|---|
| Package | Surface-mount FBGA (exact code [DATA_NEEDED: package code]) | Same Samsung DDR5 FBGA family | Same Samsung DDR5 FBGA family | Same Samsung DDR5 FBGA family |
| Brand | Samsung Electronics (Samsung Semiconductor) | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Size | 16 Gb | 16 Gb | 16 Gb | 16 Gb |
| Memory Organization | 2G x 8 | 2G x 8 | 2G x 8 | 2G x 8 |
| Technology / Data Rate | DDR5, 5600 Mbps | DDR5, 5600 Mbps (family) | DDR5, 5600 Mbps (family) | DDR5, 5600 Mbps (family) |
| Supply Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Interface | Parallel | Parallel | Parallel | Parallel |
| Lifecycle Status | Active | Active (per icDirectory) | Active (per icDirectory) | [DATA_NEEDED] |
Key Differentiators
- DDR5-5600 bandwidth leadership over DDR4 site alternatives (vs K4A8G085WB)
- x8 organization suited to standard 64/72-bit channels (vs K4RAH165VB-BCQK)
- Industrial application positioning (vs K4RAH086VB-BIWM)
Design Notes
DDR5 at 5600 Mbps/pin requires strict fly-by routing of the CA bus and per-byte length matching of DQ/DQS groups. Keep trace-length skew within the Samsung datasheet window, maintain 40-ohm single-ended / 80-ohm differential reference impedances typical of DDR5 layouts, and route over continuous reference planes. Avoid via stubs on DQ nets; use back-drilling on thick boards. Note: impedance figures are common DDR5 layout practice - confirm exact tolerances in the Samsung datasheet signal-integrity section.
The K4RAH086VP-BCWM operates from a 1.1 V rail per the JEDEC DDR5 standard. In component-level (solder-down) designs, the host board must generate this rail with a DDR5-compliant PMIC including proper power-up sequencing and VDDQ termination. Estimated: a 16-bit channel of eight x8 components drawing typical DDR5-5600 idle currents of a few tens of mA per component results in roughly 1-2 W of standby subsystem power - size the buck converter and copper pours accordingly, and verify exact current figures against the Samsung datasheet IDD tables.
Samsung encodes speed bin, package, and temperature grade in the part-number suffix, so K4RAH086VP-BCWM and K4RAH086VB-BCWM are not guaranteed to be interchangeable in all platforms. Memory-controller training (read/write leveling, DFE calibration) is speed-bin sensitive; substituting a different suffix without re-qualifying can cause boot failures. Always decode the suffix from the official Samsung ordering-information table and validate boot on the target platform before switching supply sources.
Compliance Information
Compliance data was not stated on retrieved distributor pages; request material declarations and certificates from Samsung or the distributor at time of order.
