K4RHE086VB-BCWM vs K4RCH046VM-2CCM Comparison
Detailed side-by-side comparison of K4RHE086VB-BCWM by Samsung Electronics and K4RCH046VM-2CCM by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | K4RHE086VB-BCWM | K4RCH046VM-2CCM |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7.65 | $0.00 |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM |
| Density | 24 Gb | 32 Gb |
| Organization | 2G x 8 | 4G x 4 |
| Data Rate | 5600 Mbps | 5600 Mbps |
| Supply Voltage | 1.1 V | 1.1 V |
| Package | 82 FBGA | 78-ball FBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Interface | DDR5 (JEDEC) | — |
| Configuration | x8 | — |
| Application Segment | Server / Data Center / Premium PC | — |
| Manufacturer | Samsung Semiconductor | — |
| RoHS Status | unknown | [DATA_NEEDED: RoHS status] |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | 0 to 85 C |
| Access Time / CAS Latency | [DATA_NEEDED: CAS latency] | — |
| On-Die ECC | [DATA_NEEDED: on-die ECC support] | [DATA_NEEDED: on-die ECC support] |
| Package Height | [DATA_NEEDED: package height] | — |
| Product Status | — | Sample |
| Access Latency (CL) | — | [DATA_NEEDED: CAS latency] |
| Refresh Rate | — | [DATA_NEEDED: refresh rate] |
| Interface Type | — | [DATA_NEEDED: interface type] |
| MSL Level | — | [DATA_NEEDED: moisture sensitivity level] |