K9F4G08U0B-PCB0 vs MX30LF4GE8AB Comparison
Detailed side-by-side comparison of K9F4G08U0B-PCB0 by Samsung Electronics and MX30LF4GE8AB by Macronix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K9F4G08U0B-PCB0 - 4Gbit NAND Flash, 3.3V TSOP-48 | Samsung
K9F4G08U0B-PCB0 ✓ Active
Specification Comparison
| Parameter | K9F4G08U0B-PCB0 | MX30LF4GE8AB |
|---|---|---|
| Brand | Samsung Electronics | Macronix |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3.40 | $2.98 |
| Memory Type | NAND Flash (SLC, asynchronous) | NAND Flash (SLC) |
| Density | 4 Gbit (512 MB) | 4 Gbit (512 M x 8) |
| Organization | (512M + 16M) x 8 bit | — |
| Page Size | (2 K + 64) byte | 2112 bytes (2048 + 64 spare) |
| Block Size | (128 K + 4 K) byte | 64 pages (128 KB + 4 KB spare) |
| Data Register | (2K + 64) x 8 bit | — |
| Supply Voltage (VCC) | 2.7 V to 3.6 V | — |
| Interface | 8-bit multiplexed NAND I/O | Parallel (asynchronous) |
| Package | TSOP1-48 (12 mm x 20 mm, lead-free) | 48-pin TSOP Type-I (48-TSOP) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature (commercial) | 0C to +70C | — |
| Program/Erase | Automatic, on-chip page buffer | — |
| ECC Requirement | External (1-bit/512B minimum, 4-bit recommended) | — |
| RoHS Status | Lead-free (Pb-free), RoHS compliant | Compliant |
| Package Suffix Code | -PCB0 (TSOP1, 3.3 V, commercial, lead-free) | — |
| Operating Voltage (VCC) | — | 2.7 V to 3.6 V |
| Access Time | — | 20 ns |
| Bus Width | — | 8-bit (multiplexed I/O) |
| Standard Compliance | — | ONFI 1.0 |
| Program/Erase Cycles | — | [DATA_NEEDED: P/E endurance cycles] |
| Data Retention | — | [DATA_NEEDED: retention years] |
| Operating Temperature | — | -40C to +85C (industrial) |
| MSL Level | — | [DATA_NEEDED: MSL rating] |
| Status Polling | — | R/B# open-drain output |