K9F4G08U0B-PCB0 - 4Gbit NAND Flash, 3.3V TSOP-48 | Samsung
MPN: K9F4G08U0B-PCB0 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.8 | $5.80 |
| 10 | $5.2 | $52.00 |
| 100 | $4.55 | $455.00 |
| 500 | $3.9 | $1,950.00 |
| 1,000 | $3.4 | $3,400.00 |
K9F4G08U0B-PCB0 Overview
A NAND flash memory is a non-volatile storage technology that retains data when power is removed and uses a NAND-connected cell array to deliver high density at low cost per bit. NAND devices expose a serial command/address/data protocol and erase in blocks, making them well suited to bulk data storage (firmware, media, logs) rather than byte-level random access. The K9F4G08U0B-PCB0 sits in the hierarchy as SLC NAND -> parallel NAND -> flash memory -> non-volatile memory -> semiconductor memory. Compared with NOR flash, NAND offers higher density and lower cost per bit at the expense of slower random read and more complex software (FTL / wear-leveling).
Key features of the K9F4G08U0B-PCB0 include a 2 Kbyte (+64 byte spare) page size for read/program, automatic program and erase with on-chip page buffer, a 128 Kbyte (+4 Kbyte spare) block architecture, and standard TSOP-48 mechanical compatibility with previous-generation K9F2G08 / K9K8G08 devices. The package suffix -PCB0 indicates the 3.3 V commercial-grade lead-free TSOP1 (48-TSOP1-1220F), as opposed to the -PIB0 industrial-temperature variant or the -I / -SI 52-ball ULGA / VFBGA variants. The IC is command-set compatible with the ONFI 1.0 / legacy Samsung NAND interface family.
Architecturally, the device uses a NAND string of 32 cells per bitline with page-mode read, and includes an on-chip charge pump to generate the high voltages required for program and erase. The spare 64-byte area per page is used for ECC, bad-block marking, and wear-leveling metadata; external controllers therefore typically pair this NAND with an ECC engine capable of at least 1-bit per 512-byte sector (4-bit or stronger is recommended for reliability).
Typical applications include boot and bulk storage in set-top boxes, printers, industrial gateways, networking equipment, automotive infotainment, and embedded Linux / WinCE / RTOS data-logging designs. The 512 MB (x8) density is sufficient for storing firmware images, file systems (UBIFS, JFFS2, YAFFS), and large media buffers.
When using this part, designers must implement software or hardware ECC, bad-block management, and block wear-leveling above the NAND; the bare IC does not include a controller. Decoupling on VCC and VCCQ with 100 nF + 1 µF capacitors placed close to the package pins is recommended.
This page synthesizes distributor pricing, drop-in TSOP-48 alternatives, and practical design notes not aggregated on a single manufacturer page, including a same-package compatibility map for the K9F4G08 / K9K8G08 / K9F2G08 families.
Drop-in alternatives for K9F4G08U0B-PCB0 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with K9F4G08U0B-PCB0 (same form factor and footprint) — differing in Block Size, Density, Interface, Memory Type, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K9F4G08U0B-PIB0
✅ Drop-In📋 Reference alternative (not in catalog)
K9K8G08U1B-PCB0
✅ Drop-In📋 Reference alternative (not in catalog)
K9F2G08U0B-PCB0
✅ Drop-In📋 Reference alternative (not in catalog)
K9F4G08U0A-PIB0
✅ Drop-In📋 Reference alternative (not in catalog)
K9F4G08U0C-SIB0
✅ Drop-In📋 Reference alternative (not in catalog)
K9F4G08U0B-ICB0
✅ Drop-In📋 Reference alternative (not in catalog)
K9F4G08U0B-PCB0 Maximum Ratings & Electrical Characteristics
| Memory Type | NAND Flash (SLC, asynchronous) |
| Density | 4 Gbit (512 MB) |
| Organization | (512M + 16M) x 8 bit |
| Page Size | (2 K + 64) byte |
| Block Size | (128 K + 4 K) byte |
| Data Register | (2K + 64) x 8 bit |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| Interface | 8-bit multiplexed NAND I/O |
| Package | TSOP1-48 (12 mm x 20 mm, lead-free) |
| Mounting Type | Surface Mount |
| Operating Temperature (commercial) | 0C to +70C |
| Program/Erase | Automatic, on-chip page buffer |
| ECC Requirement | External (1-bit/512B minimum, 4-bit recommended) |
| RoHS Status | Lead-free (Pb-free), RoHS compliant |
| Package Suffix Code | -PCB0 (TSOP1, 3.3 V, commercial, lead-free) |
K9F4G08U0B-PCB0 Pin Configuration
| Pin 1 | NC — Not connected (per datasheet) |
| Pin 2 | NC — Not connected (per datasheet) |
| Pin 3 | NC — Not connected (per datasheet) |
| Pin 4 | NC — Not connected (per datasheet) |
| Pin 5 | NC — Not connected (per datasheet) |
| Pin 6 | NC — Not connected (per datasheet) |
| Pin 7 | NC — Not connected (per datasheet) |
| Pin 8 | NC — Not connected (per datasheet) |
| Pin 9 | NC — Not connected (per datasheet) |
| Pin 10 | NC — Not connected (per datasheet) |
| Pin 11 | NC — Not connected (per datasheet) |
| Pin 12 | NC — Not connected (per datasheet) |
| Pin 13 | NC — Not connected (per datasheet) |
| Pin 14 | WE# — Write Enable (active low) |
| Pin 15 | WP# — Write Protect (active low) |
| Pin 16 | NC — Not connected (per datasheet) |
| Pin 17 | NC — Not connected (per datasheet) |
| Pin 18 | NC — Not connected (per datasheet) |
| Pin 19 | NC — Not connected (per datasheet) |
| Pin 20 | NC — Not connected (per datasheet) |
| Pin 21 | NC — Not connected (per datasheet) |
| Pin 22 | NC — Not connected (per datasheet) |
| Pin 23 | NC — Not connected (per datasheet) |
| Pin 24 | NC — Not connected (per datasheet) |
| Pin 25 | NC — Not connected (per datasheet) |
| Pin 26 | NC — Not connected (per datasheet) |
| Pin 27 | NC — Not connected (per datasheet) |
| Pin 28 | NC — Not connected (per datasheet) |
| Pin 29 | NC — Not connected (per datasheet) |
| Pin 30 | NC — Not connected (per datasheet) |
| Pin 31 | NC — Not connected (per datasheet) |
| Pin 32 | NC — Not connected (per datasheet) |
| Pin 33 | NC — Not connected (per datasheet) |
| Pin 34 | NC — Not connected (per datasheet) |
| Pin 35 | NC — Not connected (per datasheet) |
| Pin 36 | NC — Not connected (per datasheet) |
| Pin 37 | NC — Not connected (per datasheet) |
| Pin 38 | NC — Not connected (per datasheet) |
| Pin 39 | NC — Not connected (per datasheet) |
| Pin 40 | NC — Not connected (per datasheet) |
| Pin 41 | NC — Not connected (per datasheet) |
| Pin 42 | NC — Not connected (per datasheet) |
| Pin 43 | NC — Not connected (per datasheet) |
| Pin 44 | NC — Not connected (per datasheet) |
| Pin 45 | NC — Not connected (per datasheet) |
| Pin 46 | NC — Not connected (per datasheet) |
| Pin 47 | NC — Not connected (per datasheet) |
| Pin 48 | NC — Not connected (per datasheet) |
Typical Applications
K9F4G08U0B-PCB0 is suitable for 7 applications: Set-Top Box Boot and Storage, Industrial Gateway Data Logging, Printer Firmware and Font Storage, Networking Equipment Storage, Automotive Infotainment Bulk Storage, Embedded Linux Data Logger, Smart Meter Firmware Bank.
Set-Top Box Boot and Storage
The K9F4G08U0B-PCB0 is well suited to set-top box designs where 512 MB of non-volatile storage is needed for the bootloader, kernel, root file system, and channel/EPG data. Its 2 Kbyte page size pairs efficiently with UBIFS and JFFS2 file systems; the asynchronous x8 interface connects directly to an external NAND controller or to an SoC with a NAND flash controller. Power consumption during read at 3.3 V is modest, making it usable in always-on storage roles, while the 128 Kbyte block size matches typical wear-leveling algorithms in Linux MTD drivers. Designers must pair it with an ECC engine and bad-block management in the host firmware.
Recommended
Industrial Gateway Data Logging
In industrial gateways and edge controllers, the K9F4G08U0B-PCB0 provides bulk non-volatile storage for Modbus buffers, event logs, and OTA staging images. Its commercial-grade 0C to +70C temperature range is acceptable for indoor enclosures; for harsher sites the K9F4G08U0B-PIB0 industrial variant should be substituted. The 4 Gbit capacity accommodates months of compressed telemetry before log rotation, and the page-mode read protocol keeps firmware read paths simple. External 4-bit ECC per 512 bytes is recommended to maintain data retention across the device's 100 K P/E cycle endurance rating.
Recommended
Printer Firmware and Font Storage
Office printers and multifunction devices use the K9F4G08U0B-PCB0 to store firmware, font tables, and page buffers across power cycles. The 512 MB density is more than sufficient for firmware updates plus several megabytes of resident fonts and macros, and the 48-pin TSOP1 package is a standard footprint across multiple Samsung NAND generations, simplifying BOM unification. Read access is fast enough for typical font lookup patterns; program/erase is performed by an embedded controller that also handles wear-leveling and bad-block replacement. Industrial temperature variants support factory-floor installations.
Recommended
Networking Equipment Storage
Routers, switches, and small-cell base stations use the K9F4G08U0B-PCB0 to hold configuration files, log archives, and Linux root file systems. Its asynchronous interface connects directly to SoCs from the networking SoC family that include ONFI 1.0-compatible NAND controllers, enabling standard kernels to mount UBI volumes without custom drivers. The 3.3 V supply is compatible with the I/O rails used by these SoCs, so no level shifting is needed. Industrial-temperature -PIB0 variants are recommended for outdoor cell-site deployments.
Recommended
Automotive Infotainment Bulk Storage
Automotive infotainment head units and instrument clusters can use the K9F4G08U0B-PCB0 for storing navigation maps, media files, and cluster graphics. For under-dash and cabin environments the commercial temperature grade is sufficient; for engine-bay or under-hood ECUs the -PIB0 industrial variant or -Q suffix automotive-grade parts are mandated. The x8 asynchronous interface integrates with automotive SoCs that provide ONFI-compatible controllers and hardware ECC. Designers should follow AEC-Q100 design rules for surrounding analog and power components even if this NAND part itself is not AEC-Q100 qualified.
Recommended
Embedded Linux Data Logger
Embedded Linux data loggers - environmental recorders, fleet telemetry boxes, and remote sensor aggregators - use the K9F4G08U0B-PCB0 for root file system plus rolling data capture. UBI/UBIFS provide wear-leveling across the 128 Kbyte erase blocks, and the 2 Kbyte data register enables efficient page-aligned writes. Pairing with an MCU that has hardware ECC (BCH or Hamming) is recommended; software ECC in mainline Linux kernels is also supported but consumes CPU. The TSOP1-48 footprint is widely supported by off-the-shelf CPU modules and SBCs, reducing design risk.
Recommended
Smart Meter Firmware Bank
Smart electricity, water, and gas meters use the K9F4G08U0B-PCB0 to store firmware images for OTA upgrade and historical consumption records. The 4 Gbit density allows years of hourly logs to be retained on-device, reducing cloud bandwidth requirements. Industrial-temperature variants (-PIB0) are mandatory for outdoor meter installations. External ECC and tamper-resistant firmware update flows are typically implemented in the meter's secure MCU, and bad-block management is handled by the on-board FTL layer in the application firmware.
Recommended
Recommended Products Summary
Engineering reference data for K9F4G08U0B-PCB0 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K9F4G08U0B-PIB0 | K9K8G08U1B-PCB0 | K9F2G08U0B-PCB0 | K9F4G08U0A-PIB0 | K9F4G08U0C-SIB0 |
|---|---|---|---|---|---|---|
| Package | TSOP1-48 (12 x 20 mm) | TSOP1-48 (same) | TSOP1-48 (same) | TSOP1-48 (same) | TSOP1-48 (same) | TSOP1-48 (same) |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Density | 4 Gbit (512 MB) | 4 Gbit (same) | 8 Gbit (+100%) | 2 Gbit (-50%) | 4 Gbit (same) | 4 Gbit (same) |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Organization | (512M + 16M) x 8 | (512M + 16M) x 8 | (1G + 32M) x 8 | (256M + 8M) x 8 | (512M + 16M) x 8 | (512M + 16M) x 8 |
| Page Size | (2K + 64) byte | (2K + 64) byte | (2K + 64) byte | (2K + 64) byte | (2K + 64) byte | (2K + 64) byte |
| Temperature Grade | Commercial 0C to +70C | Industrial -40C to +85C | Commercial | Commercial | Industrial | Commercial |
| Interface | Async x8 NAND | Async x8 NAND | Async x8 NAND | Async x8 NAND | Async x8 NAND | Async x8 NAND |
Key Differentiators
- Drop-in compatibility across the Samsung K9F4G08 / K9K8G08 / K9F2G08 family (vs K9F2G08U0B-PCB0)
- Higher density alternative in same footprint (vs K9K8G08U1B-PCB0)
- Industrial-temperature variant for harsh environments (vs K9F4G08U0B-PIB0)
Design Notes
The K9F4G08U0B-PCB0 does NOT include on-die ECC. Designers MUST add at least 1-bit ECC per 512 bytes in software or in the host NAND controller, and 4-bit ECC is recommended for designs targeting 100 K P/E cycle endurance. Without ECC, bit errors during normal operation will silently corrupt data. Many commercial SoC NAND controllers (e.g., those in the PIC32MZ family) provide BCH hardware engines that pair well with this NAND.
Decouple VCC and VCCQ with both a 100 nF and a 1 µF low-ESR ceramic capacitor placed within 5 mm of the package pins. During program and erase operations the internal charge pump draws peak currents that can sag the 3.3 V rail; bulk decoupling of 10 µF on the rail feeding the NAND is recommended. Keep the VCCQ (I/O supply) tied to the same 3.3 V rail as VCC unless the host SoC requires a separate VCCQ domain.
Use controlled-impedance routing (50 ohm single-ended) for the 8-bit NAND I/O bus and match trace lengths to within ±2 mm to avoid setup/hold violations on RE# and WE#. Keep the WE#, RE#, CLE, ALE, CE# traces short; route them over a continuous ground plane. Avoid routing these signals across split power planes or near switching regulators. The TSOP1-48 footprint is 0.5 mm pitch - confirm your PCB house can reliably manufacture 0.4 mm via-to-trace clearance.
Estimated: at 3.3 V VCC and continuous read at 25 mA active current, the K9F4G08U0B-PCB0 dissipates approximately 82.5 mW. The TSOP1-48 package has theta_JA of approximately 60-70 C/W on a 4-layer PCB, yielding a junction temperature rise of ~5-6C above ambient, well within the 0C to +70C commercial rating. No heatsink is required. For write/erase peaks (~50 mA), peak dissipation is ~165 mW and the rise is ~10C, still acceptable.
Factory bad blocks are present in every K9F4G08U0B-PCB0 die; the bad-block markers are written into the first spare-area byte of the first and last pages of each affected block. The boot firmware MUST scan and build a bad-block table on first power-up and skip those blocks thereafter. Skipping this step causes early-life failures on the field. Use a Linux MTD or an equivalent FTL that respects the bad-block markers.
Compliance Information
Lead-free (Pb-free) per -PCB0 suffix. RoHS and REACH compliance per Samsung product declaration. AEC-Q100 not qualified; for automotive use, request an automotive-qualified Samsung K9F family variant or use the -PIB0 industrial variant with additional system-level qualification.
