MC7448VU867ND vs MC7448HX1000ND Comparison
Detailed side-by-side comparison of MC7448VU867ND by NXP Semiconductors and MC7448HX1000ND by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC7448VU867ND - PowerPC G4 MPU 867MHz 1MB L2 360-FCCBGA | NXP
MC7448VU867ND ⚠ Last Time BuyNXP Semiconductors
MC7448HX1000ND - PowerPC G4 MPU 1GHz 1MB L2 AltiVec | NXP
MC7448HX1000ND ✗ End of LifeSpecification Comparison
| Parameter | MC7448VU867ND | MC7448HX1000ND |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Last Time Buy | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $178.40 | $235.80 |
| Core Processor | PowerPC G4 | — |
| Architecture | RISC, 32-Bit | — |
| Number of Cores | 1 | — |
| Core Clock Speed | 867 MHz | — |
| L2 Cache | 1 MB on-chip | 1 MB on-chip, victim-replacement |
| SIMD Coprocessor | AltiVec (128-bit vector execution unit) | — |
| System Bus | MPX/60x | — |
| Core Supply Voltage | 1.0 V | — |
| I/O Supply Voltages | 1.5 V / 1.8 V / 2.5 V | — |
| Package | 360-FCCBGA, 25 x 25 mm, 1.27 mm pitch, ceramic, HCTE lid | 360-FCCBGA (25 x 25 mm) |
| Operating Temperature | -40 C to +105 C | — |
| Process Technology | 90 nm CMOS | 90 nm SOI (silicon-on-insulator) |
| Pin Count | 360 | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| RoHS Status | RoHS Compliant | [DATA_NEEDED: RoHS compliance] |
| Series | MPC74xx | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Processor Family | — | PowerPC G4 / MPC74xx |
| Core Architecture | — | 32-bit PowerPC (Book E), superscalar, out-of-order |
| Core Frequency | — | 1.0 GHz |
| System Bus (MPX/60x) | — | Up to 200 MHz DDR (64-bit) |
| L1 Cache | — | 32 KB instruction + 32 KB data |
| SIMD Engine | — | AltiVec (VMX), 128-bit |
| Core Voltage | — | 1.0 V (+/- 50 mV) |
| I/O Voltage | — | [DATA_NEEDED: I/O supply nominal] |
| Junction Operating Temperature | — | -40C to +105C |
| Packaging | — | Tray |
| Lead-Free Status | — | Contains Lead (per DigiChip summary) |
| MPN Decode (HX) | — | H = 1.0 V core, X = tape-and-reel packaging code suffix |
| Lifecycle | — | End of Life (per NXP product page header) |