MC7448VU867ND vs MC7448HX1000ND Vergleich
Detaillierter Direktvergleich von MC7448VU867ND von NXP Semiconductors und MC7448HX1000ND von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC7448VU867ND - PowerPC G4 MPU 867MHz 1MB L2 360-FCCBGA | NXP
MC7448VU867ND ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MC7448HX1000ND - PowerPC G4 MPU 1GHz 1MB L2 AltiVec | NXP
MC7448HX1000ND ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MC7448VU867ND | MC7448HX1000ND |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $178,40 | $235,80 |
| Core Processor | PowerPC G4 | — |
| Architecture | RISC, 32-Bit | — |
| Number of Cores | 1 | — |
| Core Clock Speed | 867 MHz | — |
| L2 Cache | 1 MB on-chip | 1 MB on-chip, victim-replacement |
| SIMD Coprocessor | AltiVec (128-bit vector execution unit) | — |
| System Bus | MPX/60x | — |
| Core Supply Voltage | 1.0 V | — |
| I/O Supply Voltages | 1.5 V / 1.8 V / 2.5 V | — |
| Gehäuse | 360-FCCBGA, 25 x 25 mm, 1.27 mm pitch, ceramic, HCTE lid | 360-FCCBGA (25 x 25 mm) |
| Betriebstemperatur | -40 C to +105 C | — |
| Process Technology | 90 nm CMOS | 90 nm SOI (silicon-on-insulator) |
| Pin-Anzahl | 360 | — |
| Montageart | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| RoHS-Status | RoHS Compliant | [DATA_NEEDED: RoHS compliance] |
| Series | MPC74xx | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Processor Family | — | PowerPC G4 / MPC74xx |
| Core Architecture | — | 32-bit PowerPC (Book E), superscalar, out-of-order |
| Core Frequency | — | 1.0 GHz |
| System Bus (MPX/60x) | — | Up to 200 MHz DDR (64-bit) |
| L1 Cache | — | 32 KB instruction + 32 KB data |
| SIMD Engine | — | AltiVec (VMX), 128-bit |
| Core Voltage | — | 1.0 V (+/- 50 mV) |
| I/O Voltage | — | [DATA_NEEDED: I/O supply nominal] |
| Junction Operating Temperature | — | -40C to +105C |
| Packaging | — | Tray |
| Lead-Free Status | — | Contains Lead (per DigiChip summary) |
| MPN Decode (HX) | — | H = 1.0 V core, X = tape-and-reel packaging code suffix |
| Lifecycle | — | End of Life (per NXP product page header) |