MC7448VU867ND vs MC7448HX1000ND Сравнение
Подробное сравнение бок о бок MC7448VU867ND от NXP Semiconductors и MC7448HX1000ND от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
MC7448VU867ND - PowerPC G4 MPU 867MHz 1MB L2 360-FCCBGA | NXP
MC7448VU867ND ⚠ Последняя закупкаNXP Semiconductors
MC7448HX1000ND - PowerPC G4 MPU 1GHz 1MB L2 AltiVec | NXP
MC7448HX1000ND ✗ Снят с производстваСравнение характеристик
| Параметр | MC7448VU867ND | MC7448HX1000ND |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | Microcontrollers | Microcontrollers |
| Статус жизненного цикла | Последняя закупка | Снято с производства |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $178,40 | $235,80 |
| Core Processor | PowerPC G4 | — |
| Architecture | RISC, 32-Bit | — |
| Number of Cores | 1 | — |
| Core Clock Speed | 867 MHz | — |
| L2 Cache | 1 MB on-chip | 1 MB on-chip, victim-replacement |
| SIMD Coprocessor | AltiVec (128-bit vector execution unit) | — |
| System Bus | MPX/60x | — |
| Core Supply Voltage | 1.0 V | — |
| I/O Supply Voltages | 1.5 V / 1.8 V / 2.5 V | — |
| Корпус | 360-FCCBGA, 25 x 25 mm, 1.27 mm pitch, ceramic, HCTE lid | 360-FCCBGA (25 x 25 mm) |
| Рабочая температура | -40 C to +105 C | — |
| Process Technology | 90 nm CMOS | 90 nm SOI (silicon-on-insulator) |
| Число выводов | 360 | — |
| Тип монтажа | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Статус RoHS | RoHS Compliant | [DATA_NEEDED: RoHS compliance] |
| Series | MPC74xx | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Processor Family | — | PowerPC G4 / MPC74xx |
| Core Architecture | — | 32-bit PowerPC (Book E), superscalar, out-of-order |
| Core Frequency | — | 1.0 GHz |
| System Bus (MPX/60x) | — | Up to 200 MHz DDR (64-bit) |
| L1 Cache | — | 32 KB instruction + 32 KB data |
| SIMD Engine | — | AltiVec (VMX), 128-bit |
| Core Voltage | — | 1.0 V (+/- 50 mV) |
| I/O Voltage | — | [DATA_NEEDED: I/O supply nominal] |
| Junction Operating Temperature | — | -40C to +105C |
| Packaging | — | Tray |
| Lead-Free Status | — | Contains Lead (per DigiChip summary) |
| MPN Decode (HX) | — | H = 1.0 V core, X = tape-and-reel packaging code suffix |
| Lifecycle | — | End of Life (per NXP product page header) |