MC7448VU867ND - PowerPC G4 MPU 867MHz 1MB L2 360-FCCBGA | NXP
MPN: MC7448VU867ND ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $251.61 | $251.61 |
| 10 | $238 | $2,380.00 |
| 100 | $215.5 | $21,550.00 |
| 500 | $195 | $97,500.00 |
| 1,000 | $178.4 | $178,400.00 |
MC7448VU867ND Overview
A Power Architecture MPU (microprocessor unit) is a RISC processor derived from the IBM POWER instruction set, designed for high-performance embedded computing where deterministic throughput and vector math matter. The MPC7448 family sits within the broader taxonomy of embedded CPUs -> 32-bit RISC MPU -> Power Architecture -> MPC74xx series -> MPC7448 sub-family. PowerPC G4 parts such as the MC7448VU867ND were widely used in networking, signal processing, aerospace, and military applications where reliability of the ceramic BGA package and long-term software stability outweighed raw clock speed.
Key features include the 128-bit AltiVec execution engine for SIMD-style acceleration of DSP and multimedia workloads, 1 MB of unified L2 cache that reduces external memory traffic, hardware support for out-of-order execution on the AltiVec unit, and the MPX/60x system bus for connection to NXP (and formerly Motorola/Freescale) northbridges and platform ASICs. The device operates from a 1.0 V core supply with 1.5 V / 1.8 V / 2.5 V I/O rails per the datasheet, and the ceramic FCCBGA package is rated for the industrial temperature range to 105 degrees C.
Typical applications include leading-edge pervasive and embedded computing platforms, embedded network control and routing line cards, signal-processing acceleration cards, defense and aerospace SBCs (single-board computers), and legacy PowerPC-based VME/cPCI compute nodes. The AltiVec engine is especially attractive for applications such as software-defined radio baseband, image processing, and network packet inspection.
When designing with this device, pay close attention to the multi-rail power sequencing (1.0 V core before 1.5/1.8/2.5 V I/O) and to the thermal envelope of the ceramic BGA - the HCTE ceramic lid enables conduction cooling but still requires a heatsink or cold plate at sustained loads. Pin replacement requires an exact 360-FCCBGA land pattern and BIOS/firmware validation, since the MPC7448 is a host processor, not a peripheral.
This page synthesizes current distributor pricing, parametric context, lifecycle status, and a structured alternative-part analysis not aggregated in any single manufacturer or distributor document.
Drop-in alternatives for MC7448VU867ND — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC7448VU867ND (same form factor and footprint) — differing in L2 Cache, Mounting Type, Package, Process Technology, Core Voltage.
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| Core Processor | PowerPC G4 |
| Architecture | RISC, 32-Bit |
| Number of Cores | 1 |
| Core Clock Speed | 867 MHz |
| L2 Cache | 1 MB on-chip |
| SIMD Coprocessor | AltiVec (128-bit vector execution unit) |
| System Bus | MPX/60x |
| Core Supply Voltage | 1.0 V |
| I/O Supply Voltages | 1.5 V / 1.8 V / 2.5 V |
| Package | 360-FCCBGA, 25 x 25 mm, 1.27 mm pitch, ceramic, HCTE lid |
| Operating Temperature | -40 C to +105 C |
| Process Technology | 90 nm CMOS |
| Pin Count | 360 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | RoHS Compliant |
| Series | MPC74xx |
MC7448VU867ND 360-fccbga, 25 x 25 mm, 1.27 mm pitch, ceramic, hcte lid Pin Configuration Guide
Pin configuration for MC7448VU867ND (360-fccbga, 25 x 25 mm, 1.27 mm pitch, ceramic, hcte lid package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC7448VU867ND.
Refer to the datasheet for full pin configuration.
Typical Applications
MC7448VU867ND is suitable for 6 applications: Embedded Network Control and Routing, Signal Processing and Software-Defined Radio, Aerospace and Defense Single-Board Computers, Industrial Embedded Computing, Legacy VME and cPCI Compute Nodes, Image and Multimedia Processing Acceleration.
Embedded Network Control and Routing
The MC7448VU867ND is well suited to embedded network control and routing line cards because the 867 MHz PowerPC G4 core plus 1 MB of L2 cache and the AltiVec SIMD engine deliver the deterministic throughput required for packet classification and forwarding. The MPX/60x bus lets designers connect to the platform's northbridge or switch ASIC, while the FCCBGA ceramic package supports the long-life, high-availability chassis used in telecom central offices. Concretely, the 1 MB L2 absorbs forwarding-table lookups without external memory accesses, and AltiVec accelerates hash-based ACL processing; this combination is faster than the older MPC7447 at the same clock because of the doubled L2 footprint. For new designs prefer the MPC7448VU1000ND to gain an additional 15% throughput per watt, but for existing platforms locked at 867 MHz timing references the MC7448VU867ND remains a drop-in.
Recommended
Signal Processing and Software-Defined Radio
The MC7448VU867ND's 128-bit AltiVec execution unit accelerates SIMD-style DSP kernels for software-defined radio baseband, image processing, and adaptive-filter pipelines. At 867 MHz the core delivers enough vector throughput for narrowband channelization and demodulation on VME/cPCI signal-processing cards. The FCCBGA package with HCTE ceramic lid is conduction-cooled friendly, which is critical in ruggedized MIL-spec chassis where fans are unacceptable. Designers should plan for the 1.0 V core rail with bulk decoupling on every power domain and use the MPX/60x bus to a companion DMA engine. AltiVec outperforms scalar PowerPC code by roughly 4x to 8x on typical FIR and FFT kernels, but only when the code is recompiled with -maltivec; legacy scalar binaries leave that performance on the table.
Recommended
Aerospace and Defense Single-Board Computers
The MC7448VU867ND's 360-FCCBGA ceramic package is qualified for the extended -40 C to +105 C industrial temperature range and supports the long product lifecycles required by defense and aerospace platforms. The ceramic BGA lid (HCTE) is compatible with cold-plate and conduction-cooled chassis used in avionics and naval computing. Designers building 6U VME or cPCI SBCs around this MPU benefit from the AltiVec engine for sensor-fusion and image-processing pipelines without resorting to a separate DSP. Because the device is moving toward purchase, lock in Last Time Buy inventory or qualify the higher-clocked MC7448HX1000ND as the drop-in thermal upgrade during PCN windows.
Recommended
Industrial Embedded Computing
The MC7448VU867ND fits industrial embedded computing platforms that already use the MPX/60x bus ecosystem and require a long-life MPU. The 867 MHz core plus 1 MB of L2 cache delivers responsive performance for HMI controllers, PLC co-processors, and machine-vision preprocessing nodes. The FCCBGA ceramic package tolerates the high-vibration industrial environment better than plastic BGAs of the same pin count, and the RoHS-compliant bill of materials meets modern environmental directives. Engineers porting legacy MPC7447 firmware will see a tangible L2-cache doubling, and they can recompile the AltiVec-heavy code paths to gain additional SIMD throughput on the G4 core.
Recommended
Legacy VME and cPCI Compute Nodes
The MC7448VU867ND is a natural fit for legacy VME and cPCI compute nodes that host the MPC7448 silicon and need a drop-in upgrade from older MPC7447 boards. The MPX/60x system bus preserves compatibility with existing backplanes, northbridges, and I/O mezzanines, which means existing firmware images and OS ports (VxWorks, Linux, LynxOS) run unchanged. The 867 MHz clock matches many legacy timing budgets, simplifying driver and interrupt-latency validation. For new VME boards, evaluate the 1.0 GHz MPC7448VU1000ND for additional throughput; for ruggedized cPCI military nodes, evaluate the MPC7448HX1000ND with its higher thermal envelope.
Recommended
Image and Multimedia Processing Acceleration
The MC7448VU867ND's AltiVec engine accelerates image-processing and multimedia workloads such as JPEG2000 decode, MPEG transcoding, and computer-vision preprocessing. Vector intrinsics and the 128-bit execution unit deliver per-cycle throughput that scalar PowerPC code cannot match, which makes the MPU attractive for embedded imaging subsystems that previously required a discrete DSP. The 1 MB L2 cache helps large working-set image kernels stay on-chip, and the FCCBGA package supports the thermal envelope of sustained vector workloads. AltiVec performance scales roughly linearly with clock, so the 1.0 GHz MPC7448VU1000ND delivers approximately 15% more throughput than the 867 MHz MC7448VU867ND on identical compiled code.
Recommended
Recommended Products Summary
Engineering reference data for MC7448VU867ND — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC7448VU1000ND | MC7448HX1000ND | MC7448VU933ND | PC7447MGU800NB | PC7448MGU1000ND |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | e2v technologies | e2v technologies |
| Package | 360-FCCBGA (25x25) | 360-FCCBGA (25x25) - same | 360-FCCBGA (25x25) - same | 360-FCCBGA (25x25) - same | 360-FCCBGA (25x25) - same | 360-FCCBGA (25x25) - same |
| Core Clock | 867 MHz | 1.0 GHz | 1.0 GHz | 933 MHz | 800 MHz | 1.0 GHz |
| L2 Cache | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB | 1 MB |
| Thermal Grade | VU (standard) | VU (standard) | HX (high power) | VU (standard) | Military screened | Aerospace screened |
| SIMD Engine | AltiVec 128-bit | AltiVec 128-bit | AltiVec 128-bit | AltiVec 128-bit | AltiVec 128-bit | AltiVec 128-bit |
| System Bus | MPX/60x | MPX/60x | MPX/60x | MPX/60x | MPX/60x | MPX/60x |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Discontinued | Discontinued (e2v) |
Key Differentiators
- Doubling of L2 cache vs the MPC7447 family (vs PC7447MGU800NB)
- Same-package drop-in 1.0 GHz upgrade available (vs MC7448VU1000ND)
- Conduction-cooled ceramic BGA lid for military chassis (vs PC7448MGU1000ND (e2v aerospace variant))
Design Notes
The MC7448VU867ND requires four supply rails (1.0 V core plus 1.5 V, 1.8 V, and 2.5 V I/O) and they MUST be sequenced so the 1.0 V core rail comes up before any I/O rail. Per the MPC7448 hardware specifications, violating the sequence can permanently damage the device through latch-up. Estimated: at 867 MHz the core draws roughly 6-8 A at 1.0 V; budget at least 10 A of peak headroom and place low-ESR ceramic bulk capacitors within the keep-out of every power pin.
The ceramic FCCBGA package (HCTE lid) is designed for conduction cooling, not for fan-cooled commercial boards. Estimated: VU-grade thermal resistance is approximately 1.0-1.5 C/W junction-to-case, so a 10 W dissipation yields only 10-15 C case-temperature rise; a clip-on cold plate or thermal pad is mandatory in military and aerospace chassis. For VME/cPCI platforms with low airflow, derate the clock from 867 MHz to 800 MHz or migrate to the HX-grade higher-power variant.
The 360-FCCBGA at 1.27 mm pitch requires a 4-layer or 6-layer PCB with microvia stack-ups on at least the top two layers. Per the NXP layout guideline, route the MPX/60x bus on the inner layers with matched-length tracks and 50 ohm controlled impedance, and place the clock driver within 25 mm of the CLK ball. Solder paste stencil apertures must be 1:1 with the ball pads; NSMD pads are recommended over SMD for the ceramic BGA.
Do NOT assume the MC7448VU867ND is firmware-compatible with the older MPC7447 across all binaries - the 1 MB L2 (vs 512 KB on the 7447) changes cache-locking behavior and the AltiVec revision adds out-of-order support that older AltiVec-aware code does not exercise. Validate firmware on the new die revision before deploying in production. Also verify the BIOS enumerates the L2 size correctly; mis-detected L2 is a common source of subtle data-corruption bugs.
Compliance Information
RoHS compliance per NXP product page and distributor parametric data. Ceramic BGA package, lead-free solder balls. AEC-Q100 not applicable - this is a host MPU, not an automotive analog IC. Halogen-free status not explicitly published; treat as unknown.
