MC7448VU867ND vs MC7448HX1000ND Comparaison
Comparaison détaillée côte à côte de MC7448VU867ND par NXP Semiconductors et MC7448HX1000ND par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC7448VU867ND - PowerPC G4 MPU 867MHz 1MB L2 360-FCCBGA | NXP
MC7448VU867ND ⚠ Dernier achatNXP Semiconductors
MC7448HX1000ND - PowerPC G4 MPU 1GHz 1MB L2 AltiVec | NXP
MC7448HX1000ND ✗ Fin de vieComparaison des spécifications
| Paramètre | MC7448VU867ND | MC7448HX1000ND |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $178,40 | $235,80 |
| Core Processor | PowerPC G4 | — |
| Architecture | RISC, 32-Bit | — |
| Number of Cores | 1 | — |
| Core Clock Speed | 867 MHz | — |
| L2 Cache | 1 MB on-chip | 1 MB on-chip, victim-replacement |
| SIMD Coprocessor | AltiVec (128-bit vector execution unit) | — |
| System Bus | MPX/60x | — |
| Core Supply Voltage | 1.0 V | — |
| I/O Supply Voltages | 1.5 V / 1.8 V / 2.5 V | — |
| Boîtier | 360-FCCBGA, 25 x 25 mm, 1.27 mm pitch, ceramic, HCTE lid | 360-FCCBGA (25 x 25 mm) |
| Température de fonctionnement | -40 C to +105 C | — |
| Process Technology | 90 nm CMOS | 90 nm SOI (silicon-on-insulator) |
| Nombre de broches | 360 | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Statut RoHS | RoHS Compliant | [DATA_NEEDED: RoHS compliance] |
| Series | MPC74xx | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Processor Family | — | PowerPC G4 / MPC74xx |
| Core Architecture | — | 32-bit PowerPC (Book E), superscalar, out-of-order |
| Core Frequency | — | 1.0 GHz |
| System Bus (MPX/60x) | — | Up to 200 MHz DDR (64-bit) |
| L1 Cache | — | 32 KB instruction + 32 KB data |
| SIMD Engine | — | AltiVec (VMX), 128-bit |
| Core Voltage | — | 1.0 V (+/- 50 mV) |
| I/O Voltage | — | [DATA_NEEDED: I/O supply nominal] |
| Junction Operating Temperature | — | -40C to +105C |
| Packaging | — | Tray |
| Lead-Free Status | — | Contains Lead (per DigiChip summary) |
| MPN Decode (HX) | — | H = 1.0 V core, X = tape-and-reel packaging code suffix |
| Lifecycle | — | End of Life (per NXP product page header) |