MC7448VU867ND vs MC7448HX1000ND Comparação

Comparação detalhada lado a lado de MC7448VU867ND por NXP Semiconductors e MC7448HX1000ND por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC7448VU867ND MC7448VU867ND - PowerPC G4 MPU 867MHz 1MB L2 360-FCCBGA | NXP

MC7448VU867ND - PowerPC G4 MPU 867MHz 1MB L2 360-FCCBGA | NXP

MC7448VU867ND ⚠ Última compra
NXP Semiconductors
MC7448HX1000ND MC7448HX1000ND - PowerPC G4 MPU 1GHz 1MB L2 AltiVec | NXP

MC7448HX1000ND - PowerPC G4 MPU 1GHz 1MB L2 AltiVec | NXP

MC7448HX1000ND ✗ Fim de vida

Comparação de especificações

Parâmetro MC7448VU867ND MC7448HX1000ND
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Última compra Fim de vida
Status do estoque In Stock In Stock
Preço unitário (USD) $178,40 $235,80
Core Processor PowerPC G4 —
Architecture RISC, 32-Bit —
Number of Cores 1 —
Core Clock Speed 867 MHz —
L2 Cache 1 MB on-chip 1 MB on-chip, victim-replacement
SIMD Coprocessor AltiVec (128-bit vector execution unit) —
System Bus MPX/60x —
Core Supply Voltage 1.0 V —
I/O Supply Voltages 1.5 V / 1.8 V / 2.5 V —
Encapsulamento 360-FCCBGA, 25 x 25 mm, 1.27 mm pitch, ceramic, HCTE lid 360-FCCBGA (25 x 25 mm)
Temperatura de operação -40 C to +105 C —
Process Technology 90 nm CMOS 90 nm SOI (silicon-on-insulator)
Contagem de pinos 360 —
Tipo de montagem Surface Mount (BGA) Surface Mount (flip-chip BGA)
Status RoHS RoHS Compliant [DATA_NEEDED: RoHS compliance]
Series MPC74xx —
Manufacturer — NXP Semiconductors (formerly Freescale)
Processor Family — PowerPC G4 / MPC74xx
Core Architecture — 32-bit PowerPC (Book E), superscalar, out-of-order
Core Frequency — 1.0 GHz
System Bus (MPX/60x) — Up to 200 MHz DDR (64-bit)
L1 Cache — 32 KB instruction + 32 KB data
SIMD Engine — AltiVec (VMX), 128-bit
Core Voltage — 1.0 V (+/- 50 mV)
I/O Voltage — [DATA_NEEDED: I/O supply nominal]
Junction Operating Temperature — -40C to +105C
Packaging — Tray
Lead-Free Status — Contains Lead (per DigiChip summary)
MPN Decode (HX) — H = 1.0 V core, X = tape-and-reel packaging code suffix
Lifecycle — End of Life (per NXP product page header)

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