MC9S08AW60CFGE vs MC9S08GT60CFD Comparison

Detailed side-by-side comparison of MC9S08AW60CFGE by NXP Semiconductors and MC9S08GT60CFD by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08AW60CFGE MC9S08AW60CFGE - 8-bit S08 MCU, 60KB Flash, 40MHz | NXP

MC9S08AW60CFGE - 8-bit S08 MCU, 60KB Flash, 40MHz | NXP

MC9S08AW60CFGE Nrnd
NXP Semiconductors
MC9S08GT60CFD MC9S08GT60CFD - 8-bit 40MHz S08 MCU 60KB Flash QFN48 | NXP

MC9S08GT60CFD - 8-bit 40MHz S08 MCU 60KB Flash QFN48 | NXP

MC9S08GT60CFD ✓ Active

Specification Comparison

Parameter MC9S08AW60CFGE MC9S08GT60CFD
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Active
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $5.10
Core Processor S08 (HCS08) 8-bit CISC —
Core Size 8-Bit —
Maximum CPU Frequency 40 MHz 40 MHz
Internal Bus Frequency 20 MHz —
Flash Memory 60 KB (60K x 8) —
RAM Size [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K) 4 KB (4K x 8)
Supply Voltage Range 2.7 V to 5.5 V —
I/O Count 38 general-purpose I/O —
ADC Resolution 10-bit, 8-channel —
Instruction Set HC08 instruction set with added BGND instruction —
Debug Interface Single-wire background debug mode (BDM) —
Package 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 —
Mounting Type Surface Mount Surface Mount
Supply Voltage Nominal 3.3 V / 5 V —
Operating Temperature [DATA_NEEDED: operating temperature range] —
Packaging Tray —
Lifecycle Status NRND (Not Recommended for New Designs) per NXP —
Family MC9S08AW (S08AW series) —
Manufacturer — NXP Semiconductors (formerly Freescale)
Part Family — HCS08 S08GT Series
Core Architecture — HCS08 (8-bit CISC)
Program Memory Size — 60 KB (60K x 8) Flash
Number of I/O Pins — 39
Package / Case — 48-VFQFN Exposed Pad (48-QFN 7x7 mm)
Operating Supply Voltage — 2.5V / 3.3V
Number of Interrupts/Reset Sources — Up to 32
Tray Packaging — Tray (per FindIC listing)
Background Debug Mode — Yes (BGND instruction)
Internal Pullup — Yes (RESET and IRQ pins)
RoHS Status — [DATA_NEEDED: RoHS compliance status]

Datasheets & Resources

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