MC9S08AW60CFGE vs MC9S08GT60CFD Vergleich
Detaillierter Direktvergleich von MC9S08AW60CFGE von NXP Semiconductors und MC9S08GT60CFD von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08AW60CFGE | MC9S08GT60CFD |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $5,10 |
| Core Processor | S08 (HCS08) 8-bit CISC | — |
| Core Size | 8-Bit | — |
| Maximum CPU Frequency | 40 MHz | 40 MHz |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 60 KB (60K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K) | 4 KB (4K x 8) |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| I/O Count | 38 general-purpose I/O | — |
| ADC Resolution | 10-bit, 8-channel | — |
| Instruction Set | HC08 instruction set with added BGND instruction | — |
| Debug Interface | Single-wire background debug mode (BDM) | — |
| Gehäuse | 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 | — |
| Montageart | Surface Mount | Surface Mount |
| Supply Voltage Nominal | 3.3 V / 5 V | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Packaging | Tray | — |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) per NXP | — |
| Family | MC9S08AW (S08AW series) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Family | — | HCS08 S08GT Series |
| Core Architecture | — | HCS08 (8-bit CISC) |
| Program Memory Size | — | 60 KB (60K x 8) Flash |
| Number of I/O Pins | — | 39 |
| Gehäuse / Bauform | — | 48-VFQFN Exposed Pad (48-QFN 7x7 mm) |
| Betriebsversorgungsspannung | — | 2.5V / 3.3V |
| Number of Interrupts/Reset Sources | — | Up to 32 |
| Tray Packaging | — | Tray (per FindIC listing) |
| Background Debug Mode | — | Yes (BGND instruction) |
| Internal Pullup | — | Yes (RESET and IRQ pins) |
| RoHS-Status | — | [DATA_NEEDED: RoHS compliance status] |