MC9S08AW60CFGE vs MC9S08GT60CFD Comparaison
Comparaison détaillée côte à côte de MC9S08AW60CFGE par NXP Semiconductors et MC9S08GT60CFD par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08AW60CFGE | MC9S08GT60CFD |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $5,10 |
| Core Processor | S08 (HCS08) 8-bit CISC | — |
| Core Size | 8-Bit | — |
| Maximum CPU Frequency | 40 MHz | 40 MHz |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 60 KB (60K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K) | 4 KB (4K x 8) |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| I/O Count | 38 general-purpose I/O | — |
| ADC Resolution | 10-bit, 8-channel | — |
| Instruction Set | HC08 instruction set with added BGND instruction | — |
| Debug Interface | Single-wire background debug mode (BDM) | — |
| Boîtier | 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 | — |
| Type de montage | Surface Mount | Surface Mount |
| Supply Voltage Nominal | 3.3 V / 5 V | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Packaging | Tray | — |
| Statut du cycle de vie | NRND (Not Recommended for New Designs) per NXP | — |
| Family | MC9S08AW (S08AW series) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Family | — | HCS08 S08GT Series |
| Core Architecture | — | HCS08 (8-bit CISC) |
| Program Memory Size | — | 60 KB (60K x 8) Flash |
| Number of I/O Pins | — | 39 |
| Boîtier / Format | — | 48-VFQFN Exposed Pad (48-QFN 7x7 mm) |
| Tension d'alimentation de fonctionnement | — | 2.5V / 3.3V |
| Number of Interrupts/Reset Sources | — | Up to 32 |
| Tray Packaging | — | Tray (per FindIC listing) |
| Background Debug Mode | — | Yes (BGND instruction) |
| Internal Pullup | — | Yes (RESET and IRQ pins) |
| Statut RoHS | — | [DATA_NEEDED: RoHS compliance status] |