MC9S08AW60CFGE vs MC9S08GT60CFD 对比
详细并排对比 MC9S08AW60CFGE 出自 NXP Semiconductors 和 MC9S08GT60CFD 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08AW60CFGE | MC9S08GT60CFD |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $5.10 |
| Core Processor | S08 (HCS08) 8-bit CISC | — |
| Core Size | 8-Bit | — |
| Maximum CPU Frequency | 40 MHz | 40 MHz |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 60 KB (60K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K) | 4 KB (4K x 8) |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| I/O Count | 38 general-purpose I/O | — |
| ADC Resolution | 10-bit, 8-channel | — |
| Instruction Set | HC08 instruction set with added BGND instruction | — |
| Debug Interface | Single-wire background debug mode (BDM) | — |
| 封装 | 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 | — |
| 安装类型 | Surface Mount | Surface Mount |
| Supply Voltage Nominal | 3.3 V / 5 V | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | — |
| Packaging | Tray | — |
| 生命周期状态 | NRND (Not Recommended for New Designs) per NXP | — |
| Family | MC9S08AW (S08AW series) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Family | — | HCS08 S08GT Series |
| Core Architecture | — | HCS08 (8-bit CISC) |
| Program Memory Size | — | 60 KB (60K x 8) Flash |
| Number of I/O Pins | — | 39 |
| 封装 / 外壳 | — | 48-VFQFN Exposed Pad (48-QFN 7x7 mm) |
| 工作电源电压 | — | 2.5V / 3.3V |
| Number of Interrupts/Reset Sources | — | Up to 32 |
| Tray Packaging | — | Tray (per FindIC listing) |
| Background Debug Mode | — | Yes (BGND instruction) |
| Internal Pullup | — | Yes (RESET and IRQ pins) |
| RoHS 状态 | — | [DATA_NEEDED: RoHS compliance status] |