MC9S08DZ128CLF vs MC9S08DN32AMLC Comparison
Detailed side-by-side comparison of MC9S08DZ128CLF by NXP Semiconductors and MC9S08DN32AMLC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S08DZ128CLF | MC9S08DN32AMLC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3.92 | $3.98 |
| Core | HCS08 (8-bit) | HCS08 (S08) |
| CPU Frequency | 40 MHz | 40 MHz |
| Bus Speed | 20 MHz | — |
| Flash Memory | 128 KB (128K x 8) | — |
| EEPROM | 2 KB | Embedded |
| RAM | 8 KB | 1.5 KB (1.5K x 8) |
| Supply Voltage | 2.7 V to 5.5 V | [DATA_NEEDED: VDD range] |
| Operating Temperature | -40C to +85C (industrial) | -40 C to +125 C |
| I/O Pins | 40 | — |
| ADC | 12-bit, 24-channel, 2.5 us conversion | 12-bit, up to 16 channels, 2.5 us conversion |
| CAN | MSCAN (CAN 2.0A/B), 1 module | — |
| Communication Interfaces | 1x SCI (UART), 1x SPI, 1x I2C, 1x MSCAN | — |
| Timers/PWM | 6-channel PWM timer module | — |
| Package | 48-LQFP (7x7 mm), 0.5 mm pitch | 32-LQFP (7x7 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Debug Interface | On-chip BDM (single-wire background debug) | Background Debug Mode (BDM) |
| MSL Level | 3 (per JEDEC J-STD-020) | — |
| RoHS Status | Compliant | Compliant |
| Instruction Set | — | HC08 with BGND |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 32 KB (32K x 8) |
| Number of I/O | — | 25 |
| CAN (MSCAN) | — | CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| Packaging | — | Tray |
| Oscillator Type | — | External |