MC9S08DZ128CLF vs MC9S08DN32AMLC 对比

详细并排对比 MC9S08DZ128CLF 出自 NXP Semiconductors 和 MC9S08DN32AMLC 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S08DZ128CLF MC9S08DZ128CLF - 8-bit 40MHz S08 MCU, 128KB Flash, CAN | NXP

MC9S08DZ128CLF - 8-bit 40MHz S08 MCU, 128KB Flash, CAN | NXP

MC9S08DZ128CLF Nrnd
NXP Semiconductors
MC9S08DN32AMLC MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC Nrnd

规格对比

参数 MC9S08DZ128CLF MC9S08DN32AMLC
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $3.92 $3.98
Core HCS08 (8-bit) HCS08 (S08)
CPU Frequency 40 MHz 40 MHz
Bus Speed 20 MHz —
Flash Memory 128 KB (128K x 8) —
EEPROM 2 KB Embedded
RAM 8 KB 1.5 KB (1.5K x 8)
电源电压 2.7 V to 5.5 V [DATA_NEEDED: VDD range]
工作温度 -40C to +85C (industrial) -40 C to +125 C
I/O Pins 40 —
ADC 12-bit, 24-channel, 2.5 us conversion 12-bit, up to 16 channels, 2.5 us conversion
CAN MSCAN (CAN 2.0A/B), 1 module —
Communication Interfaces 1x SCI (UART), 1x SPI, 1x I2C, 1x MSCAN —
Timers/PWM 6-channel PWM timer module —
封装 48-LQFP (7x7 mm), 0.5 mm pitch 32-LQFP (7x7 mm)
安装类型 Surface Mount Surface Mount
Debug Interface On-chip BDM (single-wire background debug) Background Debug Mode (BDM)
MSL 等级 3 (per JEDEC J-STD-020) —
RoHS 状态 Compliant Compliant
Instruction Set — HC08 with BGND
Bus Frequency — 20 MHz
Program Memory (Flash) — 32 KB (32K x 8)
Number of I/O — 25
CAN (MSCAN) — CAN 2.0 A/B
Serial Interfaces — SCI (UART), SPI, I2C
Packaging — Tray
Oscillator Type — External

数据手册与资源

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