MC9S08DZ128CLF vs MC9S08DN32AMLC Comparación
Comparación detallada lado a lado de MC9S08DZ128CLF por NXP Semiconductors y MC9S08DN32AMLC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08DZ128CLF | MC9S08DN32AMLC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,92 | $3,98 |
| Core | HCS08 (8-bit) | HCS08 (S08) |
| CPU Frequency | 40 MHz | 40 MHz |
| Bus Speed | 20 MHz | — |
| Flash Memory | 128 KB (128K x 8) | — |
| EEPROM | 2 KB | Embedded |
| RAM | 8 KB | 1.5 KB (1.5K x 8) |
| Tensión de alimentación | 2.7 V to 5.5 V | [DATA_NEEDED: VDD range] |
| Temperatura de funcionamiento | -40C to +85C (industrial) | -40 C to +125 C |
| I/O Pins | 40 | — |
| ADC | 12-bit, 24-channel, 2.5 us conversion | 12-bit, up to 16 channels, 2.5 us conversion |
| CAN | MSCAN (CAN 2.0A/B), 1 module | — |
| Communication Interfaces | 1x SCI (UART), 1x SPI, 1x I2C, 1x MSCAN | — |
| Timers/PWM | 6-channel PWM timer module | — |
| Encapsulado | 48-LQFP (7x7 mm), 0.5 mm pitch | 32-LQFP (7x7 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Debug Interface | On-chip BDM (single-wire background debug) | Background Debug Mode (BDM) |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Estado RoHS | Compliant | Compliant |
| Instruction Set | — | HC08 with BGND |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 32 KB (32K x 8) |
| Number of I/O | — | 25 |
| CAN (MSCAN) | — | CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| Packaging | — | Tray |
| Oscillator Type | — | External |