MC9S08DZ128CLF vs MC9S08DN32AMLC Vergleich
Detaillierter Direktvergleich von MC9S08DZ128CLF von NXP Semiconductors und MC9S08DN32AMLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DZ128CLF | MC9S08DN32AMLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,92 | $3,98 |
| Core | HCS08 (8-bit) | HCS08 (S08) |
| CPU Frequency | 40 MHz | 40 MHz |
| Bus Speed | 20 MHz | — |
| Flash Memory | 128 KB (128K x 8) | — |
| EEPROM | 2 KB | Embedded |
| RAM | 8 KB | 1.5 KB (1.5K x 8) |
| Versorgungsspannung | 2.7 V to 5.5 V | [DATA_NEEDED: VDD range] |
| Betriebstemperatur | -40C to +85C (industrial) | -40 C to +125 C |
| I/O Pins | 40 | — |
| ADC | 12-bit, 24-channel, 2.5 us conversion | 12-bit, up to 16 channels, 2.5 us conversion |
| CAN | MSCAN (CAN 2.0A/B), 1 module | — |
| Communication Interfaces | 1x SCI (UART), 1x SPI, 1x I2C, 1x MSCAN | — |
| Timers/PWM | 6-channel PWM timer module | — |
| Gehäuse | 48-LQFP (7x7 mm), 0.5 mm pitch | 32-LQFP (7x7 mm) |
| Montageart | Surface Mount | Surface Mount |
| Debug Interface | On-chip BDM (single-wire background debug) | Background Debug Mode (BDM) |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| RoHS-Status | Compliant | Compliant |
| Instruction Set | — | HC08 with BGND |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 32 KB (32K x 8) |
| Number of I/O | — | 25 |
| CAN (MSCAN) | — | CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| Packaging | — | Tray |
| Oscillator Type | — | External |