MC9S08DZ60AMLC vs MC9S08DZ60AMLF Comparison

Detailed side-by-side comparison of MC9S08DZ60AMLC by NXP Semiconductors and MC9S08DZ60AMLF by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08DZ60AMLC MC9S08DZ60AMLC - 8-bit 60KB Flash CAN MCU, 32-LQFP | NXP

MC9S08DZ60AMLC - 8-bit 60KB Flash CAN MCU, 32-LQFP | NXP

MC9S08DZ60AMLC Nrnd
NXP Semiconductors
MC9S08DZ60AMLF MC9S08DZ60AMLF - 8-bit S08 MCU 40MHz 60KB Flash CAN | NXP

MC9S08DZ60AMLF - 8-bit S08 MCU 40MHz 60KB Flash CAN | NXP

MC9S08DZ60AMLF Nrnd

Specification Comparison

Parameter MC9S08DZ60AMLC MC9S08DZ60AMLF
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $6.15 $0.00
Core HCS08 (CISC, 8-bit) —
CPU Frequency 40 MHz (20 MHz bus) —
Program Memory 60 KB Flash —
RAM 4 KB —
EEPROM 2 KB —
Supply Voltage 2.7 V to 5.5 V 3.3 V / 5 V
ADC 24-channel, 12-bit, 2.5 us conversion —
CAN Interface 1x MSCAN (CAN 2.0A/B) —
SCI / UART 2 —
SPI 1 —
I/O Pins 40 (32-LQFP exposed count varies by mux) —
LCD Driver Up to 8x36 segments —
Timers TPM channels included —
Package 32-LQFP (7x7 mm, 0.5 mm pitch) 48-LQFP (7x7 mm)
Operating Temperature -40 C to +125 C (automotive grade) [DATA_NEEDED: operating temperature range]
RoHS Status Compliant RoHS compliant (per distributor listing)
MSL Level [DATA_NEEDED: MSL level] —
Core Processor — S08 (HCS08), 8-bit CISC
Core Size — 8-Bit
Maximum CPU Frequency — 40 MHz (20 MHz bus)
Program Memory Size — 60 KB (60K x 8) Flash
RAM Size — 4 KB
Data EEPROM — Embedded EEPROM
Connectivity — CAN 2.0 A/B (MSCAN), LIN master-capable SCI, SPI, SCI
ADC Resolution — 12-bit
ADC Channels — 24-channel (16-channel 12-bit ADC per FindIC overview)
ADC Conversion Time — 2.5 us
Analog Comparators — 1
Interrupt/Reset Sources — Up to 32
Debug — On-chip background debug (BGND instruction)
Mounting Type — Surface Mount
Packaging — Tray
Lifecycle Status — NRND (Not Recommended for New Designs) per NXP

Datasheets & Resources

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