MC9S08DZ60AMLC vs MC9S08DZ60AMLF Vergleich

Detaillierter Direktvergleich von MC9S08DZ60AMLC von NXP Semiconductors und MC9S08DZ60AMLF von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S08DZ60AMLC MC9S08DZ60AMLC - 8-bit 60KB Flash CAN MCU, 32-LQFP | NXP

MC9S08DZ60AMLC - 8-bit 60KB Flash CAN MCU, 32-LQFP | NXP

MC9S08DZ60AMLC Nrnd
NXP Semiconductors
MC9S08DZ60AMLF MC9S08DZ60AMLF - 8-bit S08 MCU 40MHz 60KB Flash CAN | NXP

MC9S08DZ60AMLF - 8-bit S08 MCU 40MHz 60KB Flash CAN | NXP

MC9S08DZ60AMLF Nrnd

Spezifikationsvergleich

Parameter MC9S08DZ60AMLC MC9S08DZ60AMLF
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $6,15 $0,00
Core HCS08 (CISC, 8-bit) —
CPU Frequency 40 MHz (20 MHz bus) —
Program Memory 60 KB Flash —
RAM 4 KB —
EEPROM 2 KB —
Versorgungsspannung 2.7 V to 5.5 V 3.3 V / 5 V
ADC 24-channel, 12-bit, 2.5 us conversion —
CAN Interface 1x MSCAN (CAN 2.0A/B) —
SCI / UART 2 —
SPI 1 —
I/O Pins 40 (32-LQFP exposed count varies by mux) —
LCD Driver Up to 8x36 segments —
Timers TPM channels included —
Gehäuse 32-LQFP (7x7 mm, 0.5 mm pitch) 48-LQFP (7x7 mm)
Betriebstemperatur -40 C to +125 C (automotive grade) [DATA_NEEDED: operating temperature range]
RoHS-Status Compliant RoHS compliant (per distributor listing)
MSL-Level [DATA_NEEDED: MSL level] —
Core Processor — S08 (HCS08), 8-bit CISC
Core Size — 8-Bit
Maximum CPU Frequency — 40 MHz (20 MHz bus)
Program Memory Size — 60 KB (60K x 8) Flash
RAM Size — 4 KB
Data EEPROM — Embedded EEPROM
Connectivity — CAN 2.0 A/B (MSCAN), LIN master-capable SCI, SPI, SCI
ADC Resolution — 12-bit
ADC Channels — 24-channel (16-channel 12-bit ADC per FindIC overview)
ADC Conversion Time — 2.5 us
Analog Comparators — 1
Interrupt/Reset Sources — Up to 32
Debug — On-chip background debug (BGND instruction)
Montageart — Surface Mount
Packaging — Tray
Lebenszyklusstatus — NRND (Not Recommended for New Designs) per NXP

Datenblätter & Ressourcen

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