MC9S08DZ60AMLC vs MC9S08DZ60AMLF Comparaison
Comparaison détaillée côte à côte de MC9S08DZ60AMLC par NXP Semiconductors et MC9S08DZ60AMLF par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08DZ60AMLC | MC9S08DZ60AMLF |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $6,15 | $0,00 |
| Core | HCS08 (CISC, 8-bit) | — |
| CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory | 60 KB Flash | — |
| RAM | 4 KB | — |
| EEPROM | 2 KB | — |
| Tension d'alimentation | 2.7 V to 5.5 V | 3.3 V / 5 V |
| ADC | 24-channel, 12-bit, 2.5 us conversion | — |
| CAN Interface | 1x MSCAN (CAN 2.0A/B) | — |
| SCI / UART | 2 | — |
| SPI | 1 | — |
| I/O Pins | 40 (32-LQFP exposed count varies by mux) | — |
| LCD Driver | Up to 8x36 segments | — |
| Timers | TPM channels included | — |
| Boîtier | 32-LQFP (7x7 mm, 0.5 mm pitch) | 48-LQFP (7x7 mm) |
| Température de fonctionnement | -40 C to +125 C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| Statut RoHS | Compliant | RoHS compliant (per distributor listing) |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-Bit |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Program Memory Size | — | 60 KB (60K x 8) Flash |
| RAM Size | — | 4 KB |
| Data EEPROM | — | Embedded EEPROM |
| Connectivity | — | CAN 2.0 A/B (MSCAN), LIN master-capable SCI, SPI, SCI |
| ADC Resolution | — | 12-bit |
| ADC Channels | — | 24-channel (16-channel 12-bit ADC per FindIC overview) |
| ADC Conversion Time | — | 2.5 us |
| Analog Comparators | — | 1 |
| Interrupt/Reset Sources | — | Up to 32 |
| Debug | — | On-chip background debug (BGND instruction) |
| Type de montage | — | Surface Mount |
| Packaging | — | Tray |
| Statut du cycle de vie | — | NRND (Not Recommended for New Designs) per NXP |