MC9S08DZ60AMLC vs MC9S08DZ60AMLF Comparação
Comparação detalhada lado a lado de MC9S08DZ60AMLC por NXP Semiconductors e MC9S08DZ60AMLF por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MC9S08DZ60AMLC | MC9S08DZ60AMLF |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | NRND | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $6,15 | $0,00 |
| Core | HCS08 (CISC, 8-bit) | — |
| CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory | 60 KB Flash | — |
| RAM | 4 KB | — |
| EEPROM | 2 KB | — |
| Tensão de alimentação | 2.7 V to 5.5 V | 3.3 V / 5 V |
| ADC | 24-channel, 12-bit, 2.5 us conversion | — |
| CAN Interface | 1x MSCAN (CAN 2.0A/B) | — |
| SCI / UART | 2 | — |
| SPI | 1 | — |
| I/O Pins | 40 (32-LQFP exposed count varies by mux) | — |
| LCD Driver | Up to 8x36 segments | — |
| Timers | TPM channels included | — |
| Encapsulamento | 32-LQFP (7x7 mm, 0.5 mm pitch) | 48-LQFP (7x7 mm) |
| Temperatura de operação | -40 C to +125 C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| Status RoHS | Compliant | RoHS compliant (per distributor listing) |
| Nível MSL | [DATA_NEEDED: MSL level] | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-Bit |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Program Memory Size | — | 60 KB (60K x 8) Flash |
| RAM Size | — | 4 KB |
| Data EEPROM | — | Embedded EEPROM |
| Connectivity | — | CAN 2.0 A/B (MSCAN), LIN master-capable SCI, SPI, SCI |
| ADC Resolution | — | 12-bit |
| ADC Channels | — | 24-channel (16-channel 12-bit ADC per FindIC overview) |
| ADC Conversion Time | — | 2.5 us |
| Analog Comparators | — | 1 |
| Interrupt/Reset Sources | — | Up to 32 |
| Debug | — | On-chip background debug (BGND instruction) |
| Tipo de montagem | — | Surface Mount |
| Packaging | — | Tray |
| Status do ciclo de vida | — | NRND (Not Recommended for New Designs) per NXP |