MC9S12NE64VTU vs MC9S12NE64VTUE Comparison

Detailed side-by-side comparison of MC9S12NE64VTU by NXP Semiconductors and MC9S12NE64VTUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12NE64VTU MC9S12NE64VTU - 16-bit HCS12 MCU 64KB Flash EMAC 80-TQFP-EP | NXP

MC9S12NE64VTU - 16-bit HCS12 MCU 64KB Flash EMAC 80-TQFP-EP | NXP

MC9S12NE64VTU ✓ Active
NXP Semiconductors
MC9S12NE64VTUE MC9S12NE64VTUE - 16-bit HCS12 MCU, 64KB Flash, Ethernet | NXP

MC9S12NE64VTUE - 16-bit HCS12 MCU, 64KB Flash, Ethernet | NXP

MC9S12NE64VTUE Obsolete

Specification Comparison

Parameter MC9S12NE64VTU MC9S12NE64VTUE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Obsolete
Core Architecture HCS12 (16-bit CISC) —
CPU Speed 25 MHz (25 MIPS) —
Program Memory 64 KB Flash —
RAM 8 KB 8 KB [DATA_NEEDED: confirm exact SRAM size from datasheet]
EEPROM [DATA_NEEDED: EEPROM size] —
Operating Voltage (Core) 2.5 V —
Operating Voltage (I/O) 3.3 V —
Ethernet MAC Integrated 10/100 EMAC with MII interface —
ADC 10-bit, 8-channel 8-channel, 10-bit [DATA_NEEDED: confirm resolution/channels]
Timers ECT, PWM, TIM (8/16-bit) 16-bit, 4-channel Enhanced Capture Timer
Serial Interfaces SCI (UART), SPI, I2C 3 x SCI (UART), 1 x SPI, 1 x IIC
Package 80-TQFP-EP (14x14 mm) —
Mounting Type Surface Mount Surface Mount (TQFP-EP)
Operating Temperature -40C to +105C (industrial) -40C to +105C (Industrial 'V' / 'TUE' suffix)
RoHS Status Compliant Compliant
Lead-Free Yes Yes
Core Processor — HCS12
Core Size — 16-Bit
Core Clock Speed — 25 MHz
Program Memory (Flash) — 64 KB (64K x 8)
Operating Voltage — 2.5 V / 3.3 V (dual-rail VDD/VDDX)
Supply Voltage Range — 2.0 V to 5.5 V [DATA_NEEDED: confirm per datasheet]
Package / Case — 80-TQFP-EP (14x14 mm) with exposed thermal pad
Number of Pins — 80
Integrated Ethernet — 10/100 Mbps IEEE 802.3 MAC + PHY (on-chip EMAC)
CAN Controllers — 2 x msCAN 2.0A/B
PWM Channels — 8 [DATA_NEEDED: confirm channel count from datasheet]
Debug Interface — Background Debug Mode (BDM)
Terminal Form — GULL WING
Package Code — TQFP
Tray Packaging — Yes (Tray, Bakeable, Multiple in Drypack, min 60 pcs)
MSL Level — 3 [DATA_NEEDED: confirm MSL rating]

Datasheets & Resources

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