MC9S12NE64VTU vs MC9S12NE64VTUE Vergleich
Detaillierter Direktvergleich von MC9S12NE64VTU von NXP Semiconductors und MC9S12NE64VTUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S12NE64VTU - 16-bit HCS12 MCU 64KB Flash EMAC 80-TQFP-EP | NXP
MC9S12NE64VTU ✓ AktivNXP Semiconductors
MC9S12NE64VTUE - 16-bit HCS12 MCU, 64KB Flash, Ethernet | NXP
MC9S12NE64VTUE ObsoleteSpezifikationsvergleich
| Parameter | MC9S12NE64VTU | MC9S12NE64VTUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Core Architecture | HCS12 (16-bit CISC) | — |
| CPU Speed | 25 MHz (25 MIPS) | — |
| Program Memory | 64 KB Flash | — |
| RAM | 8 KB | 8 KB [DATA_NEEDED: confirm exact SRAM size from datasheet] |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Operating Voltage (Core) | 2.5 V | — |
| Operating Voltage (I/O) | 3.3 V | — |
| Ethernet MAC | Integrated 10/100 EMAC with MII interface | — |
| ADC | 10-bit, 8-channel | 8-channel, 10-bit [DATA_NEEDED: confirm resolution/channels] |
| Timers | ECT, PWM, TIM (8/16-bit) | 16-bit, 4-channel Enhanced Capture Timer |
| Serial Interfaces | SCI (UART), SPI, I2C | 3 x SCI (UART), 1 x SPI, 1 x IIC |
| Gehäuse | 80-TQFP-EP (14x14 mm) | — |
| Montageart | Surface Mount | Surface Mount (TQFP-EP) |
| Betriebstemperatur | -40C to +105C (industrial) | -40C to +105C (Industrial 'V' / 'TUE' suffix) |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Core Processor | — | HCS12 |
| Core Size | — | 16-Bit |
| Core Clock Speed | — | 25 MHz |
| Program Memory (Flash) | — | 64 KB (64K x 8) |
| Operating Voltage | — | 2.5 V / 3.3 V (dual-rail VDD/VDDX) |
| Supply Voltage Range | — | 2.0 V to 5.5 V [DATA_NEEDED: confirm per datasheet] |
| Gehäuse / Bauform | — | 80-TQFP-EP (14x14 mm) with exposed thermal pad |
| Anzahl der Pins | — | 80 |
| Integrated Ethernet | — | 10/100 Mbps IEEE 802.3 MAC + PHY (on-chip EMAC) |
| CAN Controllers | — | 2 x msCAN 2.0A/B |
| PWM Channels | — | 8 [DATA_NEEDED: confirm channel count from datasheet] |
| Debug Interface | — | Background Debug Mode (BDM) |
| Terminal Form | — | GULL WING |
| Package Code | — | TQFP |
| Tray Packaging | — | Yes (Tray, Bakeable, Multiple in Drypack, min 60 pcs) |
| MSL-Level | — | 3 [DATA_NEEDED: confirm MSL rating] |