MC9S12NE64VTU vs MC9S12NE64VTUE Comparação
Comparação detalhada lado a lado de MC9S12NE64VTU por NXP Semiconductors e MC9S12NE64VTUE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9S12NE64VTU - 16-bit HCS12 MCU 64KB Flash EMAC 80-TQFP-EP | NXP
MC9S12NE64VTU ✓ AtivoNXP Semiconductors
MC9S12NE64VTUE - 16-bit HCS12 MCU, 64KB Flash, Ethernet | NXP
MC9S12NE64VTUE ObsoleteComparação de especificações
| Parâmetro | MC9S12NE64VTU | MC9S12NE64VTUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | Obsolete |
| Core Architecture | HCS12 (16-bit CISC) | — |
| CPU Speed | 25 MHz (25 MIPS) | — |
| Program Memory | 64 KB Flash | — |
| RAM | 8 KB | 8 KB [DATA_NEEDED: confirm exact SRAM size from datasheet] |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Operating Voltage (Core) | 2.5 V | — |
| Operating Voltage (I/O) | 3.3 V | — |
| Ethernet MAC | Integrated 10/100 EMAC with MII interface | — |
| ADC | 10-bit, 8-channel | 8-channel, 10-bit [DATA_NEEDED: confirm resolution/channels] |
| Timers | ECT, PWM, TIM (8/16-bit) | 16-bit, 4-channel Enhanced Capture Timer |
| Serial Interfaces | SCI (UART), SPI, I2C | 3 x SCI (UART), 1 x SPI, 1 x IIC |
| Encapsulamento | 80-TQFP-EP (14x14 mm) | — |
| Tipo de montagem | Surface Mount | Surface Mount (TQFP-EP) |
| Temperatura de operação | -40C to +105C (industrial) | -40C to +105C (Industrial 'V' / 'TUE' suffix) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Core Processor | — | HCS12 |
| Core Size | — | 16-Bit |
| Core Clock Speed | — | 25 MHz |
| Program Memory (Flash) | — | 64 KB (64K x 8) |
| Operating Voltage | — | 2.5 V / 3.3 V (dual-rail VDD/VDDX) |
| Supply Voltage Range | — | 2.0 V to 5.5 V [DATA_NEEDED: confirm per datasheet] |
| Encapsulamento / Caixa | — | 80-TQFP-EP (14x14 mm) with exposed thermal pad |
| Número de pinos | — | 80 |
| Integrated Ethernet | — | 10/100 Mbps IEEE 802.3 MAC + PHY (on-chip EMAC) |
| CAN Controllers | — | 2 x msCAN 2.0A/B |
| PWM Channels | — | 8 [DATA_NEEDED: confirm channel count from datasheet] |
| Debug Interface | — | Background Debug Mode (BDM) |
| Terminal Form | — | GULL WING |
| Package Code | — | TQFP |
| Tray Packaging | — | Yes (Tray, Bakeable, Multiple in Drypack, min 60 pcs) |
| Nível MSL | — | 3 [DATA_NEEDED: confirm MSL rating] |