MC9S12NE64VTU vs MC9S12NE64VTUE Comparaison
Comparaison détaillée côte à côte de MC9S12NE64VTU par NXP Semiconductors et MC9S12NE64VTUE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC9S12NE64VTU - 16-bit HCS12 MCU 64KB Flash EMAC 80-TQFP-EP | NXP
MC9S12NE64VTU ✓ ActifNXP Semiconductors
MC9S12NE64VTUE - 16-bit HCS12 MCU, 64KB Flash, Ethernet | NXP
MC9S12NE64VTUE ObsoleteComparaison des spécifications
| Paramètre | MC9S12NE64VTU | MC9S12NE64VTUE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Obsolete |
| Core Architecture | HCS12 (16-bit CISC) | — |
| CPU Speed | 25 MHz (25 MIPS) | — |
| Program Memory | 64 KB Flash | — |
| RAM | 8 KB | 8 KB [DATA_NEEDED: confirm exact SRAM size from datasheet] |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Operating Voltage (Core) | 2.5 V | — |
| Operating Voltage (I/O) | 3.3 V | — |
| Ethernet MAC | Integrated 10/100 EMAC with MII interface | — |
| ADC | 10-bit, 8-channel | 8-channel, 10-bit [DATA_NEEDED: confirm resolution/channels] |
| Timers | ECT, PWM, TIM (8/16-bit) | 16-bit, 4-channel Enhanced Capture Timer |
| Serial Interfaces | SCI (UART), SPI, I2C | 3 x SCI (UART), 1 x SPI, 1 x IIC |
| Boîtier | 80-TQFP-EP (14x14 mm) | — |
| Type de montage | Surface Mount | Surface Mount (TQFP-EP) |
| Température de fonctionnement | -40C to +105C (industrial) | -40C to +105C (Industrial 'V' / 'TUE' suffix) |
| Statut RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Core Processor | — | HCS12 |
| Core Size | — | 16-Bit |
| Core Clock Speed | — | 25 MHz |
| Program Memory (Flash) | — | 64 KB (64K x 8) |
| Operating Voltage | — | 2.5 V / 3.3 V (dual-rail VDD/VDDX) |
| Supply Voltage Range | — | 2.0 V to 5.5 V [DATA_NEEDED: confirm per datasheet] |
| Boîtier / Format | — | 80-TQFP-EP (14x14 mm) with exposed thermal pad |
| Nombre de broches | — | 80 |
| Integrated Ethernet | — | 10/100 Mbps IEEE 802.3 MAC + PHY (on-chip EMAC) |
| CAN Controllers | — | 2 x msCAN 2.0A/B |
| PWM Channels | — | 8 [DATA_NEEDED: confirm channel count from datasheet] |
| Debug Interface | — | Background Debug Mode (BDM) |
| Terminal Form | — | GULL WING |
| Package Code | — | TQFP |
| Tray Packaging | — | Yes (Tray, Bakeable, Multiple in Drypack, min 60 pcs) |
| Niveau MSL | — | 3 [DATA_NEEDED: confirm MSL rating] |