MC9S12NE64VTU vs MC9S12NE64VTUE Сравнение

Подробное сравнение бок о бок MC9S12NE64VTU от NXP Semiconductors и MC9S12NE64VTUE от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.

NXP Semiconductors
MC9S12NE64VTU MC9S12NE64VTU - 16-bit HCS12 MCU 64KB Flash EMAC 80-TQFP-EP | NXP

MC9S12NE64VTU - 16-bit HCS12 MCU 64KB Flash EMAC 80-TQFP-EP | NXP

MC9S12NE64VTU ✓ Активен
NXP Semiconductors
MC9S12NE64VTUE MC9S12NE64VTUE - 16-bit HCS12 MCU, 64KB Flash, Ethernet | NXP

MC9S12NE64VTUE - 16-bit HCS12 MCU, 64KB Flash, Ethernet | NXP

MC9S12NE64VTUE Obsolete

Сравнение характеристик

Параметр MC9S12NE64VTU MC9S12NE64VTUE
Бренд NXP Semiconductors NXP Semiconductors
Категория Microcontrollers Microcontrollers
Статус жизненного цикла Активен Obsolete
Core Architecture HCS12 (16-bit CISC) —
CPU Speed 25 MHz (25 MIPS) —
Program Memory 64 KB Flash —
RAM 8 KB 8 KB [DATA_NEEDED: confirm exact SRAM size from datasheet]
EEPROM [DATA_NEEDED: EEPROM size] —
Operating Voltage (Core) 2.5 V —
Operating Voltage (I/O) 3.3 V —
Ethernet MAC Integrated 10/100 EMAC with MII interface —
ADC 10-bit, 8-channel 8-channel, 10-bit [DATA_NEEDED: confirm resolution/channels]
Timers ECT, PWM, TIM (8/16-bit) 16-bit, 4-channel Enhanced Capture Timer
Serial Interfaces SCI (UART), SPI, I2C 3 x SCI (UART), 1 x SPI, 1 x IIC
Корпус 80-TQFP-EP (14x14 mm) —
Тип монтажа Surface Mount Surface Mount (TQFP-EP)
Рабочая температура -40C to +105C (industrial) -40C to +105C (Industrial 'V' / 'TUE' suffix)
Статус RoHS Compliant Compliant
Lead-Free Yes Yes
Core Processor — HCS12
Core Size — 16-Bit
Core Clock Speed — 25 MHz
Program Memory (Flash) — 64 KB (64K x 8)
Operating Voltage — 2.5 V / 3.3 V (dual-rail VDD/VDDX)
Supply Voltage Range — 2.0 V to 5.5 V [DATA_NEEDED: confirm per datasheet]
Корпус / Типоразмер — 80-TQFP-EP (14x14 mm) with exposed thermal pad
Количество выводов — 80
Integrated Ethernet — 10/100 Mbps IEEE 802.3 MAC + PHY (on-chip EMAC)
CAN Controllers — 2 x msCAN 2.0A/B
PWM Channels — 8 [DATA_NEEDED: confirm channel count from datasheet]
Debug Interface — Background Debug Mode (BDM)
Terminal Form — GULL WING
Package Code — TQFP
Tray Packaging — Yes (Tray, Bakeable, Multiple in Drypack, min 60 pcs)
Уровень MSL — 3 [DATA_NEEDED: confirm MSL rating]

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