MCF5251CVM140 vs MCF5253CVM140 Comparison
Detailed side-by-side comparison of MCF5251CVM140 by NXP Semiconductors and MCF5253CVM140 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MCF5251CVM140 - ColdFire V2 140MHz MPU, USB-OTG, 225-MAPBGA | NXP
MCF5251CVM140 ⚠ Last Time Buy
Specification Comparison
| Parameter | MCF5251CVM140 | MCF5253CVM140 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Last Time Buy | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $18.20 | $27.40 |
| Core Architecture | ColdFire V2 (32-bit) | — |
| Maximum Core Frequency | 140 MHz | — |
| Core Type | 32-Bit MPU | — |
| Program Memory Type | ROMless (external flash required) | ROMless (external memory) |
| Package | 225-MAPBGA (13x13 mm, also described as 225-LFBGA) | — |
| Operating Voltage | [DATA_NEEDED: core/IO voltage range] | — |
| USB Interface | USB-OTG with integrated PHY (Host + Function) | — |
| Enhanced MAC (eMAC) | Yes - hardware multiply-accumulator | — |
| Real-Time Clock | Yes - tamper-proof RTC | — |
| Ethernet | 10/100 MAC (on selected family members) | — |
| External Bus Interface | 32-bit with SDRAM controller and chip-select logic | — |
| Operating Temperature Range | -40C to +85C (industrial, inferred from CVM suffix) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | — |
| RoHS Status | [DATA_NEEDED: confirm RoHS declaration] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: confirm lead-free] | — |
| Core Processor | — | ColdFire V2 (MCF525x) |
| Core Size | — | 32-Bit |
| Speed | — | 140 MHz |
| RAM Size | — | 128K x 8 |
| Oscillator Type | — | External |
| Connectivity | — | USB-OTG |
| Peripherals | — | eMAC, tamper-proof RTC, USB-OTG |
| Supply Voltage | — | 3.3 V |
| Package / Case | — | 225-LFBGA (225-MAPBGA, 13x13 mm) |
| Architecture | — | RISC, enhanced multiplier-accumulator (eMAC) |
| Application Target | — | Consumer / Industrial (audio decode, file management, system control) |
| Supplier Device Package | — | 225-MAPBGA |
| Lifecycle Status | — | End of Life (per NXP product page) |
| Operating Temperature | — | [DATA_NEEDED: operating temperature range] |